SCHEMBL4601126

SCHEMBL4601126

C=CC(=O)Sc1ccc([N+](=O)[O-])cc1

nearest known ligand 0.51

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TGM2 P21980 1/20 0.51
TDP1 Q9NUW8 1/20 0.48
TERT O14746 1/20 0.47
CES1 P23141 2/20 0.46
MEN1 O00255 3/20 0.44
KMT2A Q03164 3/20 0.44
MAPT P10636 2/20 0.44
SRD5A2 P31213 1/20 0.44
CA1 P00915 2/20 0.44
CA2 P00918 2/20 0.44
MAPK1 P28482 2/20 0.43
TSHR P16473 1/20 0.43
ALDH1A1 P00352 1/20 0.43
HPGD P15428 1/20 0.42
HTT P42858 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
CES2 O00748 1/20 0.41
CASP3 P42574 1/20 0.40
GAA P10253 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4857114 0.82 AKT1 (0.36) TGM2MAPTTSHRALDH1A1HPGD
SCHEMBL28941770 0.79 CES1 (0.54) TDP1TERTCES1MEN1KMT2A
SCHEMBL21445736 0.77 TDP1 (0.55) TDP1TERTCES1MEN1KMT2A
SCHEMBL1532181 0.77 TSHR (0.59) TDP1TERTCES1MEN1KMT2A
SCHEMBL16170754 0.77 AKT1 (0.32) MAPT
SCHEMBL1023934 0.77 HPGD (0.41) MEN1KMT2AMAPTMAPK1TSHR
SCHEMBL16170352 0.77 AKT1 (0.32) MAPT
SCHEMBL20567657 0.76 ALDH1A1 (0.57) TDP1TERTCES1MEN1KMT2A
SCHEMBL27450016 0.76 MAPK1 (0.57) TDP1TERTCES1MEN1KMT2A
SCHEMBL11450903 0.74 MAPT (0.53) TGM2TERTMEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7462653-B2 Photocurable and thermosetting composition for ink jet system and printed circuit boards made by use thereof TAIYO INK MANUFACTURING CO., LTD. (JP) 2008-12-09 US disclosed
EP-1624001-B1 PHOTOCURING/THERMOSETTING INKJET COMPOSITION AND PRINTED WIRING BOARD USING SAME TAIYO INK MFG CO LTD (JP) 2008-04-16 EP disclosed
US-20060058412-A1 Monomer having a (meth)acryloyl group and thermosetting functional group; a photoreactive diluent having a weight-average molecular weight of not more than 700; photopolymerization initiator; viscosity of not more than 150 mPa*s at 25 degrees C.; solder resist pattern directly drawn on printed circuit TAIYO INK MFG. CO., LTD. (JP) 2006-03-16 US disclosed
EP-1624001-A1 PHOTOCURING/THERMOSETTING INKJET COMPOSITION AND PRINTED WIRING BOARD USING SAME Taiyo Ink Manufacturing Co. Ltd (JP) 2006-02-08 EP disclosed