SCHEMBL4605698

SCHEMBL4605698

CCCCCCCCOc1ccc([I+]c2ccccc2)cc1.Cc1ccccc1S(=O)(=O)[O-]

nearest known ligand 0.45

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 2/20 0.45
TSHR P16473 2/20 0.42
TP53 P04637 1/20 0.42
PLA2G4B P0C869 1/20 0.41
CA12 O43570 1/20 0.41
CA1 P00915 1/20 0.41
CA2 P00918 1/20 0.41
CA7 P43166 1/20 0.41
CA9 Q16790 1/20 0.41
FAAH O00519 6/20 0.40
NPC1 O15118 1/20 0.40
RAB9A P51151 1/20 0.40
RARB P10826 3/20 0.40
NR5A1 Q13285 1/20 0.40
ALDH1A1 P00352 1/20 0.39
GAA P10253 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4605693 0.85 ALDH1A1 (0.46) LTA4HTSHRTP53PLA2G4BCA12
SCHEMBL9418021 0.85 ALDH1A1 (0.46) LTA4HTSHRTP53PLA2G4BCA12
SCHEMBL9418015 0.85 ALDH1A1 (0.46) LTA4HTSHRTP53PLA2G4BCA12
SCHEMBL12748728 0.82 LTA4H (0.64) LTA4HTSHRTP53PLA2G4BFAAH
SCHEMBL4839363 0.82 LTA4H (0.64) LTA4HTSHRTP53PLA2G4BFAAH
SCHEMBL838064 0.82 LTA4H (0.64) LTA4HTSHRTP53PLA2G4BFAAH
SCHEMBL2224932 0.82 LTA4H (0.64) LTA4HTSHRTP53PLA2G4BFAAH
SCHEMBL145006 0.82 LTA4H (0.64) LTA4HTSHRTP53PLA2G4BFAAH
SCHEMBL6276133 0.82 LTA4H (0.64) LTA4HTSHRTP53PLA2G4BFAAH
SCHEMBL3874556 0.82 LTA4H (0.64) LTA4HTSHRTP53PLA2G4BFAAH

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1943287-A2 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE General Electric Company (US) 2008-07-16 EP disclosed
US-7378455-B2 A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device GENERAL ELECTRIC COMPANY (US) 2008-05-27 US disclosed
WO-2007005280-A2 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE GENERAL ELECTRIC COMPANY (US) 2007-01-11 WO disclosed
US-20070004819-A1 A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device CITIBANK, N.A., AS COLLATERAL AGENT 2007-01-04 US disclosed
US-6008265-A CATIONIC POLYMERS HAVING ONIUM GROUPS AND A SULFONIMIDE ANION AS PHOTOINITIATORS FOR PHOTOPOLYMERIZATION; ADHESIVES; COATINGS; PHOTORESISTS HYDRO-QUEBEC (CA) 1999-12-28 US disclosed