SCHEMBL4606069

SCHEMBL4606069

O=S(=O)(OI)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.44

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
CA2 P00918 14/20 0.44
CA1 P00915 13/20 0.43
MMP1 P03956 5/20 0.43
MMP2 P08253 5/20 0.43
MMP9 P14780 5/20 0.43
MMP8 P22894 5/20 0.43
MMP13 P45452 5/20 0.43
F2 P00734 4/20 0.39
PRSS1 P07477 4/20 0.39
PRSS2 P07478 4/20 0.39
PRSS3 P35030 4/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1760784 0.98 CA2 (0.48) CA2CA1MMP1MMP2MMP9
SCHEMBL167861 0.79 CA2 (0.48) CA2CA1MMP1MMP2MMP9
SCHEMBL8108242 0.77 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL11810378 0.77 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL11806270 0.77 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL1146256 0.77 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL3960813 0.77 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL11802495 0.77 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL8437170 0.77 CA2 (0.52) CA2CA1MMP1MMP2MMP9
SCHEMBL6396150 0.77 CA2 (0.52) CA2CA1MMP1MMP2MMP9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2005057285-A1 THERMAL CURABLE ONE-LIQUID TYPE EPOXY RESIN COMPOSITION FOR OVER-COAT SAMYANGEMS CO., LTD. (KR) 2005-06-23 WO claimed
CN-109843853-B Composition and method for manufacturing device using the same 东洋合成工业株式会社 2022-09-20 CN disclosed
EP-1943287-A2 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE General Electric Company (US) 2008-07-16 EP disclosed
US-7378455-B2 A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device GENERAL ELECTRIC COMPANY (US) 2008-05-27 US disclosed
EP-1788438-A1 MATERIAL FOR FORMATION OF RESIST PROTECTION FILM AND METHOD OF FORMING RESIST PATTERN THEREWITH TOKYO OHKA KOGYO CO., LTD. (JP) 2007-05-23 EP disclosed
WO-2007005280-A2 MOLDING COMPOSITION AND METHOD, AND MOLDED ARTICLE GENERAL ELECTRIC COMPANY (US) 2007-01-11 WO disclosed
US-20070004819-A1 A curable epoxy resin , two latent cationic curing catalyst, a free radical-producng cocatalyst and inorganic filler of about 70-95 weight % based on the total weight; catalyst allows the use of increased filler loadingsto reduce moisture absorption and thermal expansion; encapsulating solid state device CITIBANK, N.A., AS COLLATERAL AGENT 2007-01-04 US disclosed
US-6358665-B1 ONIUM SALT PRECURSOR FOR GENERATING FLUOROALKYLSULFONATE CLARIANT INTERNATIONAL LTD. (CH) 2002-03-19 US disclosed
EP-1033624-A1 RADIATION-SENSITIVE COMPOSITION OF CHEMICAL AMPLIFICATION TYPE Clariant International Ltd. (CH) 2000-09-06 EP disclosed