SCHEMBL461271

SCHEMBL461271

Cn1ncc(C(=O)O)n1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24690574 0.82
SCHEMBL2644600 0.80
SCHEMBL21910790 0.77 RIPK1 (0.33)
SCHEMBL23599093 0.77 MALT1 (0.36)
SCHEMBL22518526 0.75 KDM4E (0.41)
SCHEMBL31705072 0.73 CHEK1 (0.38)
SCHEMBL927297 0.73
SCHEMBL17610631 0.73 KDM4E (0.35)
SCHEMBL4806134 0.73
SCHEMBL30850118 0.72 GABRG2 (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 98 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12630740-B2 Compositions containing thermally conductive fillers PPG INDUSTRIES OHIO, INC. (US) 2026-05-19 US disclosed
EP-4737449-A1 P53-Y220C SELECTIVE SMALL-MOLECULAR REACTIVATOR COMPOUND, PHARMACEUTICAL COMPOSITION AND USE THEREOF Changchun Genescience Pharmaceutical Co., Ltd. (CN) 2026-05-06 EP disclosed
EP-4136139-B1 USE OF A COATING FORMED FROM A COMPOSITION CONTAINING THERMALLY CONDUCTIVE FILLERS TO PROVIDE A SUBSTRATE WITH THERMAL AND FIRE PROTECTION PPG IND OHIO INC (US) 2025-08-20 EP disclosed
EP-4136136-B1 CONTROLLING CURE RATE WITH WETTED FILLER PRC DESOTO INT INC (US) 2025-01-29 EP disclosed
WO-2025002177-A1 P53-Y220C SELECTIVE SMALL-MOLECULAR REACTIVATOR COMPOUND, PHARMACEUTICAL COMPOSITION AND USE THEREOF 长春金赛药业有限责任公司 2025-01-02 WO disclosed
WO-2024248935-A1 COMPOSITIONS CONTAINING THERMALLY CONDUCTIVE FILLER AND THERMALLY EXPANDABLE MATERIAL PPG INDUSTRIES OHIO, INC. (US) 2024-12-05 WO disclosed
CN-115698153-B Composition containing heat conductive filler PPG工业俄亥俄公司 2024-07-30 CN disclosed
CN-114829476-B Composition containing heat conductive filler PPG工业俄亥俄公司 2024-04-12 CN disclosed
CN-115702187-B Composition, cured composition and part comprising cured composition PRC-迪索托国际公司 2024-02-13 CN disclosed
CN-113785019-B Control of cure rate using polyether synergists PRC-迪索托国际公司 2023-12-05 CN disclosed
EP-1487828-B1 MORPHOLINYL-UREA DERIVATIVES FOR USE OF THE TREATMENT OF INFLAMATORY DISEASES GLAXO GROUP LTD (GB) 2008-11-05 EP disclosed
EP-1713778-B1 BENZAZEPINE DERIVATIVES AS HISTAMINE H3 ANTAGONISTS GLAXO GROUP LTD (GB) 2008-01-16 EP disclosed
WO-2007096576-A1 HERBICIDAL ISOXAZOLINE COMPOUNDS SYNGENTA LIMITED (GB) 2007-08-30 WO disclosed
US-20060063765-A1 Novel compounds GLAXO GROUP LIMITED (GB) 2006-03-23 US disclosed
CN-1656092-A Robertson Graeme Michael et al. GLAXO GROUP LTD (GB) 2005-08-17 CN disclosed
EP-1487828-A2 MORPHOLINYL-UREA DERIVATIVES FOR USE OF THE TREATMENT OF INFLAMATORY DISEASES GLAXO GROUP LIMITED (GB) 2004-12-22 EP disclosed
WO-2003082861-A2 MORPHOLINYL-UREA DERIVATIVES FOR USE OF THE TREATMENT OF INFLAMMATORY DISEASES GLAXO GROUP LIMITED (GB) 2003-10-09 WO disclosed
EP-0732373-A1 Curable silicone composition Dow Corning Toray Silicone Company Limited (JP) 1996-09-18 EP disclosed
US-4310444-A POLYSILOXANES, SILICA, PLATINUM OR PLATINUM COMPOUND, FATTY ACID OR ITS SALT AND A PEROXIDE TORAY SILICONE COMPANY, LTD. (JP) 1982-01-12 US disclosed
US-4087399-A ORGANO-POLYSILOXANE, SILICA FILLER, PLATINUM, CARBON BLACK, TITANIUM DIOXIDE, AND TRIAZOLE COMPOUND TORAY SILICONE COMPANY, LTD. (JA) 1978-05-02 US disclosed