SCHEMBL4619014

SCHEMBL4619014

C[Si](C)(OCc1ccccc1[N+](=O)[O-])c1ccccc1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.48
HTT P42858 1/20 0.48
TSHR P16473 1/20 0.47
CA12 O43570 1/20 0.47
CA9 Q16790 1/20 0.47
MAOB P27338 1/20 0.47
HPGD P15428 1/20 0.44
NPC1 O15118 2/20 0.42
RAB9A P51151 2/20 0.42
KMT2A Q03164 2/20 0.42
MEN1 O00255 1/20 0.42
SMN1; SMN2 Q16637 1/20 0.42
HTR1A P08908 1/20 0.40
ADRA1D P25100 1/20 0.40
ADRA1A P35348 1/20 0.40
ADRA1B P35368 1/20 0.40
POLB P06746 1/20 0.40
CYP2C19 P33261 1/20 0.40
TDP1 Q9NUW8 1/20 0.40
ACHE P22303 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4620364 0.95 ALDH1A1 (0.49) ALDH1A1HTTTSHRCA12CA9
SCHEMBL8033745 0.91 CA12 (0.41) ALDH1A1HTTTSHRCA12CA9
SCHEMBL10426754 0.89 ALDH1A1 (0.44) ALDH1A1HTTTSHRCA12CA9
SCHEMBL4620380 0.88 ALDH1A1 (0.48) ALDH1A1HTTTSHRCA12CA9
SCHEMBL4618336 0.88 ALDH1A1 (0.48) ALDH1A1HTTTSHRCA12CA9
SCHEMBL4620366 0.86 ALDH1A1 (0.49) ALDH1A1HTTTSHRCA12CA9
Ethane SCHEMBL8643809 0.85 ALDH1A1 (0.48) ALDH1A1HTTTSHRCA12CA9
SCHEMBL4619256 0.84 ALDH1A1 (0.50) ALDH1A1HTTTSHRCA12CA9
SCHEMBL4620141 0.84 ALDH1A1 (0.50) ALDH1A1HTTTSHRCA12CA9
SCHEMBL4621114 0.84 ALDH1A1 (0.50) ALDH1A1HTTTSHRCA12CA9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025122450-A1 PHOTOCAGED METAL/METALLOID-ALKOXY AND SILOXANE POLYMER BUILDING BLOCKS AND APPLICATIONS THEREOF BOWLING GREEN STATE UNIVERSITY (US) 2025-06-12 WO disclosed
CN-112292414-A Cation-curable composition and method for producing cured product 迪睿合株式会社 2021-01-29 CN disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
US-6096836-A OXYGEN CONTAINING AROMATIC CATALYST AND ALUMINUM COMPOUND KABUSHIKI KAISHA TOSHIBA (JP) 2000-08-01 US disclosed
US-5811497-A STORAGE STABLE EPOXY RESINS ACTIVATE THE CURING WHEN APPLYING THE HEAT; FLEXIBILITY, DIELECTRIC, MECHANICAL STRENGTH KABUSHIKI KAISHA TOSHIBA (JP) 1998-09-22 US disclosed
US-4816496-A HEAT AND LIGHT RESISTANT ADHESIVES AND FILMS KABUSHIKI KAISHA TOSHIBA (JP) 1989-03-28 US disclosed
EP-0135887-B1 PHOTOCURABLE COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-04-06 EP disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed
US-4599155-A POLYORTHOESTERS;SHRINKAGE INHIBITION;NONCRACKING;COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1986-07-08 US disclosed
EP-0172330-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1986-02-26 EP disclosed
EP-0139234-A2 Resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-05-02 EP disclosed
EP-0135887-A2 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-04-03 EP disclosed
US-4476290-A Photocurable silicon compound composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1984-10-09 US disclosed
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP disclosed
EP-0104590-A1 Photocurable silicon compound composition KABUSHIKI KAISHA TOSHIBA (JP) 1984-04-04 EP disclosed