Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | RELA | Q04206 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22654210 | 0.82 | SMN1; SMN2 (0.33) | — | |
| SCHEMBL675838 | 0.81 | ACHE (0.33) | MEN1KMT2A | |
| SCHEMBL22654156 | 0.81 | CA2 (0.34) | MEN1KMT2A | |
| SCHEMBL22654249 | 0.78 | KDM4E (0.37) | — | |
| SCHEMBL705286 | 0.78 | LTA4H (0.34) | RELA | |
| SCHEMBL674277 | 0.77 | RELA (0.32) | MEN1KMT2ARELA | |
| SCHEMBL252065 | 0.77 | ALDH1A1 (0.30) | — | |
| SCHEMBL9900069 | 0.76 | — | — | |
| SCHEMBL23701265 | 0.75 | LTA4H (0.32) | — | |
| SCHEMBL708782 | 0.75 | TP53 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2665777-B1 | HYDROLYSIS-STABLE POLYAMIDES | BASF SE (DE) | 2014-11-19 | — | — | EP | disclosed |
| US-8623983-B2 | Terpolymer of electron-deficient olefins, olefins without electron-withdrawing substituents, and alkoxyvinylsilanes | BASF SE (DE) | 2014-01-07 | — | — | US | disclosed |
| EP-2614092-A1 | TERPOLYMER FORMED FROM ELECTRON-DEFICIENT OLEFINS, OLEFINS WITHOUT ELECTRON-WITHDRAWING SUBSTITUENTS AND ALKOXYVINYLSILANES | BASF SE (DE) | 2013-07-17 | — | — | EP | disclosed |
| EP-1746132-B1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | ADEKA CORP (JP) | 2013-07-10 | — | — | EP | disclosed |
| US-20120184664-A1 | HYDROLYSIS-RESISTANT POLYAMIDES | BASF SE (DE) | 2012-07-19 | — | — | US | disclosed |
| EP-1801871-B1 | SEMICONDUCTOR DEVICE | KANSAI ELECTRIC POWER CO (JP) | 2012-07-11 | — | — | EP | disclosed |
| WO-2012032005-A1 | TERPOLYMER FORMED FROM ELECTRON-DEFICIENT OLEFINS, OLEFINS WITHOUT ELECTRON-WITHDRAWING SUBSTITUENTS AND ALKOXYVINYLSILANES | BASF SE (DE) | 2012-03-15 | — | — | WO | disclosed |
| US-20120059101-A1 | TERPOLYMER OF ELECTRON-DEFICIENT OLEFINS, OLEFINS WITHOUT ELECTRON-WITHDRAWING SUBSTITUENTS, AND ALKOXYVINYLSILANES | BASF SE (DE) | 2012-03-08 | — | — | US | disclosed |
| US-7939614-B2 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2011-05-10 | — | — | US | disclosed |
| US-7772594-B2 | covered with a synthetic high molecular compound which is a silicon-containing curable polymer composition having excellent heat resistance and flexibility; high voltage; fluorine-free; platinum curing catalyst | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2010-08-10 | — | — | US | disclosed |
| US-20080210948-A1 | High-Heat-Resistive Semiconductor Device | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2008-09-04 | — | — | US | disclosed |
| US-20070197755-A1 | Silicon-containing curing composition and heat cured product thereof | ADEKA CORPORATION (JP) | 2007-08-23 | — | — | US | disclosed |
| EP-1801871-A1 | SEMICONDUCTOR DEVICE | THE KANSAI ELECTRIC POWER CO., INC. (JP) | 2007-06-27 | — | — | EP | disclosed |
| EP-1746132-A1 | SILICON-CONTAINING CURABLE COMPOSITION AND CURED OBJECT OBTAINED BY THERMALLY CURING THE SAME | Adeka Corporation (JP) | 2007-01-24 | — | — | EP | disclosed |