SCHEMBL4620924

SCHEMBL4620924

CCC(O[Si](c1ccccc1)(c1ccccc1)c1ccccc1)c1ccccc1[N+](=O)[O-]

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 7/20 0.43
CYP1A2 P05177 2/20 0.43
TSHR P16473 2/20 0.43
LMNA P02545 1/20 0.38
TDP1 Q9NUW8 3/20 0.37
MEN1 O00255 4/20 0.37
KMT2A Q03164 4/20 0.37
HSD17B10 Q99714 1/20 0.37
RECQL P46063 2/20 0.36
NPC1 O15118 2/20 0.36
RAB9A P51151 2/20 0.36
CA12 O43570 1/20 0.36
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CA9 Q16790 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
MAPT P10636 1/20 0.36
MAPK1 P28482 1/20 0.36
L3MBTL1 Q9Y468 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11116022 0.83 ALDH1A1 (0.39) ALDH1A1CYP1A2TSHRLMNATDP1
SCHEMBL17695124 0.78 ALDH1A1 (0.49) ALDH1A1CYP1A2TSHRLMNATDP1
SCHEMBL28538587 0.78 ALDH1A1 (0.49) ALDH1A1CYP1A2TSHRLMNATDP1
SCHEMBL1060758 0.75 ALDH1A1 (0.47) ALDH1A1CYP1A2TSHRLMNATDP1
SCHEMBL8067996 0.74 ALDH1A1 (0.59) ALDH1A1CYP1A2TSHRLMNATDP1
SCHEMBL28398494 0.73 ALDH1A1 (0.51) ALDH1A1CYP1A2TSHRLMNATDP1
SCHEMBL4620107 0.72 ALDH1A1 (0.47) ALDH1A1CYP1A2TSHRTDP1MEN1
SCHEMBL4620391 0.72 ALDH1A1 (0.47) ALDH1A1CYP1A2TSHRTDP1MEN1
SCHEMBL28557758 0.72 CYP1A2 (0.51) ALDH1A1CYP1A2TSHRLMNATDP1
SCHEMBL7564168 0.72 ALDH1A1 (0.49) ALDH1A1CYP1A2TSHRLMNATDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 39 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP claimed
US-11773208-B2 Cationically curable composition and cured product production method DEXERIALS CORPORATION (JP) 2023-10-03 US disclosed
US-20210214489-A1 CATIONICALLY CURABLE COMPOSITION AND CURED PRODUCT PRODUCTION METHOD DEXERIALS CORPORATION (JP) 2021-07-15 US disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
EP-1462496-A2 Coating composition and method for application thereof KANSAI PAINT CO., LTD. (JP) 2004-09-29 EP disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
US-4831063-A RAPID CURING OF AN UNSATURATED EPOXY/ORGANOALUMINUM COMPOUND MIXTURE BY ADDING A SILYLPEROXY COMPOUND; PAINTS; COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1989-05-16 US disclosed
US-4816496-A HEAT AND LIGHT RESISTANT ADHESIVES AND FILMS KABUSHIKI KAISHA TOSHIBA (JP) 1989-03-28 US disclosed
EP-0282634-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1988-09-21 EP disclosed
EP-0135887-B1 PHOTOCURABLE COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-04-06 EP disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed
US-4599155-A POLYORTHOESTERS;SHRINKAGE INHIBITION;NONCRACKING;COATINGS KABUSHIKI KAISHA TOSHIBA (JP) 1986-07-08 US disclosed
EP-0172330-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1986-02-26 EP disclosed
EP-0139234-A2 Resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-05-02 EP disclosed
EP-0135887-A2 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1985-04-03 EP disclosed
EP-0114258-A1 Resin encapsulation type photo-semiconductor devices KABUSHIKI KAISHA TOSHIBA (JP) 1984-08-01 EP disclosed