SCHEMBL4620107

SCHEMBL4620107

C[Si](OC(c1ccccc1[N+](=O)[O-])c1ccccc1[N+](=O)[O-])(OC(c1ccccc1[N+](=O)[O-])c1ccccc1[N+](=O)[O-])c1ccccc1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.47
CYP1A2 P05177 4/20 0.44
TSHR P16473 1/20 0.42
TDP1 Q9NUW8 5/20 0.40
HSD17B10 Q99714 2/20 0.40
L3MBTL1 Q9Y468 2/20 0.36
MEN1 O00255 4/20 0.36
KMT2A Q03164 4/20 0.36
RECQL P46063 2/20 0.36
CYP3A4 P08684 2/20 0.36
CYP2D6 P10635 2/20 0.36
CYP2C9 P11712 2/20 0.36
CYP2C19 P33261 2/20 0.36
GLA P06280 1/20 0.36
POLB P06746 1/20 0.36
MAPT P10636 1/20 0.36
CA1 P00915 1/20 0.36
NPC1 O15118 1/20 0.36
RAB9A P51151 1/20 0.36
HTT P42858 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4620391 0.88 ALDH1A1 (0.47) ALDH1A1CYP1A2TSHRTDP1HSD17B10
SCHEMBL4617975 0.84 ALDH1A1 (0.51) ALDH1A1CYP1A2TSHRTDP1HSD17B10
SCHEMBL2777973 0.75 ALDH1A1 (0.54) ALDH1A1CYP1A2TSHRTDP1HSD17B10
SCHEMBL4620924 0.72 ALDH1A1 (0.43) ALDH1A1CYP1A2TSHRTDP1HSD17B10
SCHEMBL384635 0.72 CYP1A2 (0.50) ALDH1A1CYP1A2TSHRTDP1HSD17B10
SCHEMBL7947082 0.72 CYP1A2 (0.46) ALDH1A1CYP1A2TSHRTDP1HSD17B10
SCHEMBL9679556 0.72 ALDH1A1 (0.51) ALDH1A1CYP1A2TSHRTDP1HSD17B10
SCHEMBL8728613 0.72 ALDH1A1 (0.51) ALDH1A1CYP1A2TSHRTDP1HSD17B10
SCHEMBL8728605 0.72 ALDH1A1 (0.51) ALDH1A1CYP1A2TSHRTDP1HSD17B10
SCHEMBL10694617 0.71 ALDH1A1 (0.51) ALDH1A1CYP1A2TSHRTDP1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 31 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11773208-B2 Cationically curable composition and cured product production method DEXERIALS CORPORATION (JP) 2023-10-03 US disclosed
US-20210214489-A1 CATIONICALLY CURABLE COMPOSITION AND CURED PRODUCT PRODUCTION METHOD DEXERIALS CORPORATION (JP) 2021-07-15 US disclosed
CN-112292414-A Cation-curable composition and method for producing cured product 迪睿合株式会社 2021-01-29 CN disclosed
EP-1889862-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2008-02-20 EP disclosed
EP-1172393-B1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEM (JP) 2007-10-31 EP disclosed
US-6924008-B2 Curable resin composition, a method for the preparation thereof, and a coated article thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2005-08-02 US disclosed
EP-1462496-A2 Coating composition and method for application thereof KANSAI PAINT CO., LTD. (JP) 2004-09-29 EP disclosed
US-20030032729-A1 Curable resin composition, process for producing the same, and coated object made with the same DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 2003-02-13 US disclosed
US-6437090-B1 ORGANOMETALLIC COMPOUND CAPABLE OF REVERSIBLY DISSOLVING AND PRECIPITATING THROUGH HEATING AND COOLING; ORGANOSILICON COMPOUND; ONE LIGAND CONTAINS AN ALKYL GROUP HAVING 10 OR MORE CARBON ATOMS; EPOXY RESIN; STORAGE STABLE; ONLY CURES ON HEAT KABUSHIKI KAISHA TOSHIBA (JP) 2002-08-20 US disclosed
EP-1172393-A1 CURABLE RESIN COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND COATED OBJECT MADE WITH THE SAME DAICEL CHEMICAL INDUSTRIES, Ltd. (JP) 2002-01-16 EP disclosed
EP-0540027-A2 Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-05-05 EP disclosed
US-5198509-A Curable composition with epoxy groups and esters DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1993-03-30 US disclosed
US-5169965-A Heat-curable or photocurable compounds; coatings; toughness; finishing; low-temperature cure DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1992-12-08 US disclosed
EP-0466596-A2 Lactone-modified alicyclic composition, and an epoxidized composition thereof DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1992-01-15 EP disclosed
EP-0459913-A2 Composition comprising a novel alicyclic compound, a process for the preparation thereof, a curable composition, and a photo-polymerizable composition DAICEL CHEMICAL INDUSTRIES, LTD. (JP) 1991-12-04 EP disclosed
EP-0195846-B1 PHOTO-CURABLE EPOXY RESIN TYPE COMPOSITION AND CURING PROCESS KABUSHIKI KAISHA TOSHIBA (JP) 1991-07-31 EP disclosed
US-4975471-A Photo-curable epoxy resin type composition KABUSHIKI KAISHA TOSHIBA (JP) 1990-12-04 US disclosed
US-4816496-A HEAT AND LIGHT RESISTANT ADHESIVES AND FILMS KABUSHIKI KAISHA TOSHIBA (JP) 1989-03-28 US disclosed
EP-0282634-A1 Photocurable composition KABUSHIKI KAISHA TOSHIBA (JP) 1988-09-21 EP disclosed
EP-0195846-A2 Photo-curable epoxy resin type composition and curing process KABUSHIKI KAISHA TOSHIBA (JP) 1986-10-01 EP disclosed