SCHEMBL4622599

SCHEMBL4622599

C[Si](C)(C)O[Si](C)(COc1cccc(N)c1)COc1cccc(N)c1

nearest known ligand 0.56

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 4/20 0.56
TP53 P04637 1/20 0.56
TSHR P16473 1/20 0.49
MAOB P27338 2/20 0.47
ALDH1A1 P00352 1/20 0.47
APP P05067 1/20 0.44
POLB P06746 1/20 0.38
HSP90AA1 P07900 1/20 0.38
MAPT P10636 1/20 0.38
LTA4H P09960 1/20 0.38
CYP1A2 P05177 1/20 0.36
CASP1 P29466 1/20 0.35
RECQL P46063 1/20 0.35
MAP4K4 O95819 1/20 0.35
CYP2D6 P10635 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL895776 0.83 CYP3A4 (0.59) CYP3A4TP53TSHRMAOBALDH1A1
SCHEMBL10594544 0.83 TSHR (0.56) CYP3A4TP53TSHRMAOBALDH1A1
SCHEMBL10940049 0.81 TSHR (0.59) CYP3A4TP53TSHRMAOBALDH1A1
SCHEMBL10938457 0.79 TDP1 (0.50) CYP3A4TP53TSHRMAOBALDH1A1
SCHEMBL27601560 0.74 CYP3A4 (0.53) CYP3A4TP53TSHRMAOBALDH1A1
SCHEMBL9066494 0.74 TSHR (0.54) CYP3A4TP53TSHRMAOBALDH1A1
SCHEMBL28464024 0.74 ALDH1A1 (0.52) CYP3A4TP53TSHRMAOBALDH1A1
SCHEMBL894725 0.73 TSHR (0.57) CYP3A4TP53TSHRMAOBALDH1A1
SCHEMBL29371541 0.72 CYP3A4 (1.00) CYP3A4TP53TSHRMAOBALDH1A1
SCHEMBL8904993 0.72 ALDH1A1 (0.59) CYP3A4TP53TSHRMAOBALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4737506-A1 CURED FILM AND ORGANIC EL DISPLAY DEVICE Toray Industries, Inc. (JP) 2026-05-06 EP disclosed
WO-2025005010-A1 CURED FILM AND ORGANIC EL DISPLAY DEVICE 東レ株式会社 2025-01-02 WO disclosed
CN-116848635-A Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using the same 株式会社巴川制纸所 2023-10-03 CN disclosed
CN-115699273-A Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using the same 株式会社巴川制纸所 2023-02-03 CN disclosed
WO-2022176585-A1 ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE PRODUCTION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME 株式会社巴川製紙所 2022-08-25 WO disclosed
WO-2021241359-A1 ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE PRODUCTION AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING SAME 株式会社巴川製紙所 2021-12-02 WO disclosed
CN-111566177-B Adhesive sheet for manufacturing semiconductor device and method for manufacturing semiconductor device using the same 株式会社巴川制纸所 2021-10-26 CN disclosed
US-20210139390-A1 PRODUCTION METHOD OF ORGANIC COMPOUND UNITIKA LTD. (JP) 2021-05-13 US disclosed
EP-3819283-A1 METHOD FOR PRODUCING ORGANIC COMPOUND Unitika Ltd. (JP) 2021-05-12 EP disclosed
CN-112384489-A Method for producing organic compound 尤尼吉可株式会社 2021-02-19 CN disclosed
US-6132865-A METAL SUBSTRATE AND ADHESIVE LAYERS TOMOEGAWA PAPER CO., LTD. (JP) 2000-10-17 US disclosed
US-6045886-A TWO ADHESIVE LAYERS ARE RESIN LAYERS COMPOSED OF 100-40% BY MOL OF A POLYIMIDE; SAID TWO ADHESIVE LAYERS HAVING EACH A DIFFERENT GLASS TRANSITION TEMPERATURE; HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 2000-04-04 US disclosed
US-5959068-A LIQUID POLYIMIDE BASED ON AROMATIC DIAMINE MONOMERS AND 4,4'-MONOETHYLENE TRIMELLATE AND/OR BIS/4-DICARBOXYPHENYL/-SULFONE ON A HEAT-RESISTANT FILM; ADHERING PARTS AROUND LEADFRAMES MAKING UP SEMICONDUCTOR DEVICES, E.G LEAD PINS TOMOEGAWA PAPER CO., LTD. (JP) 1999-09-28 US disclosed
US-5891540-A POLYIMIDE TOMOEGAWA PAPER CO., LTD. (JP) 1999-04-06 US disclosed
US-5866250-A POLYIMIDE TOMOEGAWA PAPER CO., LTD. (JP) 1999-02-02 US disclosed
US-5863988-A OXIDATION RESISTANT CURABLE ADHESIVE COMPRISING A DISSOLVED ACRYLONITRILE-BUTADIENE COPOLYMER, A PHENOLIC RESIN, A DIAMINE, DIMALEIMIDE COMPOUND AND/OR A POLYSILOXANE; FREE FROM GENERATING GAS, CURING AT LOW TEMPERATURE TOMOEGAWA PAPER CO., LTD. (JP) 1999-01-26 US disclosed
US-5851616-A Adhesive tape for electronic parts and liquid adhesive TOMOEGAWA PAPER CO., LTD. (JP) 1998-12-22 US disclosed
US-5723571-A POLYIMIDESILOXANE COPOLYMERS TOMOEGAWA PAPER CO., LTD. (JP) 1998-03-03 US disclosed
US-5663287-A SOLUBLE IN ORGANIC SOLVENTS AND EXCELS IN HEAT RESISTANCE TOMOEGAWA PAPER CO., LTD. (JP) 1997-09-02 US disclosed
EP-0729996-A1 Polyimide and process for producing the same TOMOEGAWA PAPER CO. LTD. (JP) 1996-09-04 EP disclosed