Acrylic Acid

Acrylic Acid

SCHEMBL4622901

C=CC(=O)O.C=CC(=O)O.CC(C)(CO)COC(=O)C(C)(C)CO

nearest known ligand 0.38

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.38
TP53 P04637 1/20 0.38
CYP3A4 P08684 1/20 0.38
MAPK1 P28482 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
HIF1A Q16665 1/20 0.38
LMNA P02545 1/20 0.34
CYP4F2 P78329 1/20 0.31
CYP4A11 Q02928 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Fumaric Acid SCHEMBL11210787 0.88 HCAR2 (0.37) TP53CYP4F2CYP4A11
SCHEMBL26021 0.87 CYP4F2 (0.37) CYP4F2CYP4A11
Acrylic Acid SCHEMBL21295490 0.85 ALDH1A1 (0.37) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL12403725 0.83 CYP4F2 (0.35) CYP4F2CYP4A11
Methacrylic Acid SCHEMBL6737902 0.83 CYP4F2 (0.31) CYP4F2CYP4A11
SCHEMBL2383383 0.83 ALDH1A1 (0.55) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
Acrylic Acid SCHEMBL28603672 0.82 LMNA (0.37) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL27696058 0.82 ALDH1A1 (0.34) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL9507667 0.81 ALDH1A1 (0.53) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2
SCHEMBL12403723 0.81 CYP4F2 (0.38) ALDH1A1TP53CYP3A4MAPK1SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240392054-A1 IMPROVED MONOMER COMPOSITIONS FOR TEMPERATURE RESISTANCE AFTER CURING ILLUMING POWER INC. (CA) 2024-11-28 US claimed
US-20240279400-A1 DUAL CURABLE SILICONE COMPOSITION DOW SILICONES CORP (US) 2024-08-22 US claimed
CN-118043366-A Monomer composition with improved post-cure temperature resistance 亿明动力公司 2024-05-14 CN claimed
EP-4359454-A1 DUAL CURABLE SILICONE COMPOSITION Dow Silicones Corporation (US) 2024-05-01 EP claimed
CN-117355549-A Dual cure silicone composition 美国陶氏有机硅公司 2024-01-05 CN claimed
WO-2022271590-A1 DUAL CURABLE SILICONE COMPOSITION DOW SILICONES CORPORATION (US) 2022-12-29 WO claimed
EP-4654948-A1 HYDROGELS CONTAINING ATROPINE Universidade de Santiago de Compostela (ES) 2025-12-03 EP disclosed
US-20240392054-A1 IMPROVED MONOMER COMPOSITIONS FOR TEMPERATURE RESISTANCE AFTER CURING ILLUMING POWER INC. (CA) 2024-11-28 US disclosed
US-20240384227-A1 MATERIALS CHEMISTRIES AND MICROTOPOGRAPHIES AND USES THEREOF THE UNIVERSITY OF NOTTINGHAM (GB) 2024-11-21 US disclosed
WO-2024213714-A1 PLASMA ENRICHED IN PLATELETS AND PLASMA MOLECULES SANTXA RESEARCH S.L.U. (ES) 2024-10-17 WO disclosed
EP-4445905-A1 PLASMA ENRICHED IN PLATELETS AND PLASMA MOLECULES Santxa Research S.L.U. (ES) 2024-10-16 EP disclosed
US-20240279400-A1 DUAL CURABLE SILICONE COMPOSITION DOW SILICONES CORP (US) 2024-08-22 US disclosed
WO-2024156632-A1 GOLD NANOPARTICLE HYDROGELS UNIVERSIDADE DE SANTIAGO DE COMPOSTELA (ES) 2024-08-02 WO disclosed
CN-117417489-A UV-LED cured resin composition, preparation method and application thereof 长兴合成树脂(常熟)有限公司 2024-01-19 CN disclosed
CN-117355549-A Dual cure silicone composition 美国陶氏有机硅公司 2024-01-05 CN disclosed
CN-113164882-B Membrane for selective substance delivery 科德宝两合公司 2023-12-22 CN disclosed
WO-2022271590-A1 DUAL CURABLE SILICONE COMPOSITION DOW SILICONES CORPORATION (US) 2022-12-29 WO disclosed
US-20220059857-A1 MEMBRANE FOR THE SELECTIVE TRANSPORT OF SUBSTANCES CARL FREUDENBERG KG (DE) 2022-02-24 US disclosed
EP-1904210-A2 FILTER MEDIUM FOR TECHNICAL APPLICATIONS, AND METHOD FOR THE PRODUCTION THEREOF Mahle International GmbH (DE) 2008-04-02 EP disclosed
WO-2007006292-A2 FILTER MEDIUM FOR TECHNICAL APPLICATIONS, AND METHOD FOR THE PRODUCTION THEREOF MAHLE INTERNATIONAL GMBH (DE) 2007-01-18 WO disclosed