Known targets — ChEMBL curated mechanism
ADORA1ADORA2AADORA2BADORA3PDE3APDE3BPDE4APDE4BPDE4CPDE4D
The experimentally established mechanism targets of Ethylenediamine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethylenediamine SCHEMBL8975294 | 0.96 | ALDH1A1 (0.77) | — | |
| Ethylenediamine SCHEMBL9766852 | 0.96 | ALDH1A1 (0.77) | — | |
| SCHEMBL757716 | 0.91 | — | — | |
| SCHEMBL1773428 | 0.91 | — | — | |
| SCHEMBL175732 | 0.91 | ALDH1A1 (1.00) | — | |
| SCHEMBL27327 | 0.91 | — | — | |
| SCHEMBL9324790 | 0.87 | ALDH1A1 (0.91) | — | |
| SCHEMBL7936337 | 0.87 | — | — | |
| Hydrochloric Acid SCHEMBL2260838 | 0.87 | — | — | |
| SCHEMBL9507538 | 0.87 | ALDH1A1 (0.91) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 66 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20200277514-A1 | Chemical Mechanical Polishing For Copper And Through Silicon Via Applications | VERSUM MATERIALS US, LLC (US) | 2020-09-03 | — | — | US | claimed |
| EP-3702425-A1 | CHEMICAL MECHANICAL POLISHING FOR COPPER AND THROUGH SILICON VIA APPLICATIONS | Versum Materials US, LLC (US) | 2020-09-02 | — | — | EP | claimed |
| US-20190055430-A1 | Chemical Mechanical Planarization (CMP) Composition and Methods Therefore for Copper and Through Silica Via (TSV) Applications | VERSUM MATERIALS US, LLC (US) | 2019-02-21 | — | — | US | claimed |
| EP-3444309-A1 | CHEMICAL MECHANICAL PLANARIZATION (CMP) COMPOSITION AND METHODS THEREFORE FOR COPPER AND THROUGH SILICA VIA (TSV) APPLICATIONS | Versum Materials US, LLC (US) | 2019-02-20 | — | — | EP | claimed |
| US-20020028293-A1 | Liquid crystal polymers for flexible circuits | 3M INNOVATIVE PROPERTIES COMPANY | 2002-03-07 | — | — | US | claimed |
| EP-0626994-A4 | FUEL ADDITIVE COMPOSITIONS CONTAINING POLY(OXYALKYLENE) HYDROXYAROMATIC ESTERS AND POLY(OXYALKYLENE) AMINES. | CHEVRON RES (US) | 1995-08-23 | — | — | EP | claimed |
| EP-0626994-A1 | FUEL ADDITIVE COMPOSITIONS CONTAINING POLY(OXYALKYLENE) HYDROXYAROMATIC ESTERS AND POLY(OXYALKYLENE) AMINES | CHEVRON CHEMICAL COMPANY (US) | 1994-12-07 | — | — | EP | claimed |
| WO-1994014930-A1 | FUEL ADDITIVE COMPOSITIONS CONTAINING POLY(OXYALKYLENE) HYDROXYAROMATIC ESTERS AND POLY(OXYALKYLENE) AMINES | CHEVRON RESEARCH AND TECHNOLOGY COMPANY (US) | 1994-07-07 | — | — | WO | claimed |
| EP-0208541-B1 | LUBRICANT COMPOSITIONS | NIPPON OIL CO. LTD. (JP) | 1991-12-04 | — | — | EP | claimed |
| EP-3902879-A1 | LOW TEMPERATURE CURING OF WATERBORNE COATINGS | BASF Coatings GmbH (DE) | 2021-11-03 | — | — | EP | disclosed |
| EP-3702425-A1 | CHEMICAL MECHANICAL POLISHING FOR COPPER AND THROUGH SILICON VIA APPLICATIONS | Versum Materials US, LLC (US) | 2020-09-02 | — | — | EP | disclosed |
| WO-2020136016-A1 | LOW TEMPERATURE CURING OF WATERBORNE COATINGS | BASF COATINGS GMBH (DE) | 2020-07-02 | — | — | WO | disclosed |
| CN-110402263-A | VISCOELASTIC POLYURETHANE FOAMS WITH REDUCED TEMPERATURE SENSITIVITY | COVESTRO LLC | 2019-11-01 | — | — | CN | disclosed |
| US-10253168-B2 | Additive composition for amine hardeners, use of said additive composition, and amine hardener composition containing said additive composition | HILTI AKTIENGESELLSCHAFT (LI) | 2019-04-09 | — | — | US | disclosed |
| WO-2001036552-A1 | WATERBORNE PRIMER WITH IMPROVED CHIP RESISTANCE | BASF CORPORATION (US) | 2001-05-25 | — | — | WO | disclosed |
| US-6210758-B1 | APPLYING LAYER OF CHIP RESISTANT PRIMER COMPRISING POLYURETHANE AND REACTIVE COMPONENT; APPLYING SECOND LAYER OF PRIMER COMPRISING THERMOSETTING POLYURETHANE AND CROSSLINKING AGENT; APPLYING TOPCOAT LAYER | BASF CORPORATION | 2001-04-03 | — | — | US | disclosed |
| WO-2000034403-A1 | PROCESS FOR IMPROVING HYDROLYSIS RESISTANCE OF POLYURETHANE DISPERSION ADHESIVES AND BONDED ASSEMBLIES PRODUCED THEREFROM | H.B. FULLER LICENSING & FINANCING, INC. (US) | 2000-06-15 | — | — | WO | disclosed |
| EP-0068807-B1 | ACID COPPER ELECTROPLATING BATHS CONTAINING BRIGHTENING AND LEVELLING ADDITIVES | M & T CHEMICALS, INC. (US) | 1987-04-01 | — | — | EP | disclosed |
| US-4376685-A | ALKYLATED EPIHALOHYDRIN-MODIFIED POLYALKYLENIMINES | M&T CHEMICALS INC. (US) | 1983-03-15 | — | — | US | disclosed |
| EP-0068807-A2 | Acid copper electroplating baths containing brightening and levelling additives | M & T CHEMICALS, INC. (US) | 1983-01-05 | — | — | EP | disclosed |