SCHEMBL463327

SCHEMBL463327

C=C(C)C(=O)OCC(CO)(CO)COC(=O)C(=C)C.OCC(CO)(CO)CO

nearest known ligand 0.45

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.45
ALDH1A1 P00352 3/20 0.44
TP53 P04637 1/20 0.44
CYP3A4 P08684 1/20 0.44
MAPK1 P28482 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
HIF1A Q16665 1/20 0.44
THRB P10828 1/20 0.42
POLB P06746 1/20 0.32
APEX1 P27695 1/20 0.32
HTT P42858 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2454708 1.00 TSHR (0.45) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL33308 0.98 TSHR (0.47) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL23498428 0.96 ALDH1A1 (0.48) TSHRALDH1A1TP53CYP3A4MAPK1
Methacrylic Acid SCHEMBL1463859 0.94 TSHR (0.41) TSHRALDH1A1TP53CYP3A4MAPK1
Ethylene Glycol SCHEMBL14740130 0.94 TSHR (0.44) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL1030890 0.94 TSHR (0.47) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL15234 0.94 TSHR (0.47) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL60306 0.94 ALDH1A1 (0.50) TSHRALDH1A1TP53CYP3A4MAPK1
SCHEMBL59221 0.92 THRB (0.44) TSHRALDH1A1TP53CYP3A4MAPK1
Methacrylic Acid SCHEMBL6678734 0.90 TSHR (0.41) TSHRALDH1A1TP53CYP3A4MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180280602-A1 SIZE-SELECTIVE HEMOCOMPATIBLE POLYMER SYSTEM CYTOSORBENTS CORPORATION 2018-10-04 US claimed
US-8101339-B2 Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-01-24 US disclosed
US-20090317746-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-12-24 US disclosed