SCHEMBL465339

SCHEMBL465339

C#CNc1ccccc1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Benzene SCHEMBL28686547 1.00 ALDH1A1 (0.45)
Hydrochloric Acid SCHEMBL29730399 0.97 ALDH1A1 (0.43)
SCHEMBL27780348 0.97 ALDH1A1 (0.43)
SCHEMBL27820487 0.97 ALDH1A1 (0.43)
SCHEMBL1358827 0.92 ALDH1A1 (0.39)
SCHEMBL28126651 0.92 TSHR (0.42)
Bromobenzene SCHEMBL29087862 0.88 ALDH1A1 (0.50)
Chlorobenzene SCHEMBL28705277 0.88 TSHR (0.50)
Fluorobenzene SCHEMBL28932894 0.88 NOX1 (0.38)
Iodobenzene SCHEMBL28686568 0.88 ALDH1A1 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 568 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116041957-B Polyimide film and preparation method thereof 吉林高琦聚酰亚胺材料有限公司 2025-03-25 CN claimed
CN-119505236-A Thermosetting polyimide adhesive material based on silicon-oxygen connection ethynyl aniline end capping 江苏海洋大学 2025-02-25 CN claimed
CN-115521457-B Polyimide resin 宁波领科新材料科技有限公司 2024-10-29 CN claimed
CN-117186402-A Ethynyl aniline end capped isoamide material and its prepn process 南通芯盟测试研究院运营管理有限公司 2023-12-08 CN claimed
CN-116041957-A Polyimide film and preparation method thereof 长春聚明光电材料有限公司 2023-05-02 CN claimed
CN-112812353-B Flexible colorless transparent polyimide composite structure and preparation method thereof 长春聚明光电材料有限公司 2023-04-28 CN claimed
CN-115521457-A Polyimide resin 宁波领科新材料科技有限公司 2022-12-27 CN claimed
CN-112645826-B Preparation method of ethynylaniline 浙江师范大学 2022-06-10 CN claimed
CN-114163639-A Polyimide film for flexible AMOLED 南京中鸿润宁新材料科技有限公司 2022-03-11 CN claimed
CN-112062908-B Low-dielectric unsaturated benzoxazine resin composition and preparation method thereof 材翼新材料科技(苏州)有限公司 2021-11-30 CN claimed
US-20050014925-A1 Polyamic acid oligomer, polyimide oligomer, solution composition, and fiber-reinforced composite material JSR CORPORATION (JP) 2005-01-20 US claimed
US-20040096773-A1 Soluble polyimide for photosensitive polyimide precursor and photosensitive polyimide precursor composition comprising the soluble polyimide SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-05-20 US claimed
US-6048959-A POLYETHERIMIDE COPOLYMERS AND FORMING THIN FILMS THE UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF THE NATIONAL AERONAUTICS AND SPACE ADMINISTRATION (US) 2000-04-11 US claimed
US-5741585-A Polyamic acid precursors and methods for preparing higher molecular weight polyamic acids and polyimidebenzoxazole THE DOW CHEMICAL COMPANY (US) 1998-04-21 US claimed
EP-0822954-A1 POLYAMIC ACID PRECURSORS AND METHOD FOR PREPARING POLYIMIDEBENZOXAZOLE THE DOW CHEMICAL COMPANY (US) 1998-02-11 EP claimed
WO-1996034033-A1 POLYAMIC ACID PRECURSORS AND METHOD FOR PREPARING POLYIMIDEBENZOXAZOLE THE DOW CHEMICAL COMPANY (US) 1996-10-31 WO claimed
EP-0507561-B1 Thermoplastic resin compositions NOF CORP (JP) 1996-06-26 EP claimed
EP-0370753-B1 Modified polyolefin particles and process for preparation thereof MITSUI PETROCHEMICAL IND (JP) 1995-01-18 EP claimed
EP-0022281-B1 AMINO COMPOUNDS AND USE OF AMINO COMPOUNDS AS ANTIOXYDANT IN LUBRICATING OILS UNIROYAL, INC. (US) 1983-09-14 EP claimed
EP-0050428-A1 Ethynylated aromatic compounds and process for making same Hughes Aircraft Company (US) 1982-04-28 EP claimed