Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 2/20 | 0.60 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.60 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.60 |
| ▸ | LMNA | P02545 | 1/20 | 0.60 |
| ▸ | MAPT | P10636 | 1/20 | 0.60 |
| ▸ | OPRK1 | P41145 | 1/20 | 0.60 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.60 |
| ▸ | POLB | P06746 | 2/20 | 0.38 |
| ▸ | PDK2 | Q15119 | 4/20 | 0.35 |
| ▸ | ESR1 | P03372 | 1/20 | 0.32 |
| ▸ | ESR2 | Q92731 | 1/20 | 0.32 |
| ▸ | MDM2 | Q00987 | 1/20 | 0.30 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.30 |
| ▸ | HPGD | P15428 | 1/20 | 0.30 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29488299 | 0.85 | MEN1 (0.60) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL4657916 | 0.85 | MEN1 (0.60) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL4657918 | 0.85 | MEN1 (0.60) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL4660239 | 0.78 | MEN1 (0.68) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL7055911 | 0.77 | MEN1 (0.66) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL29581020 | 0.77 | MEN1 (0.66) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL29426418 | 0.77 | MAPT (1.00) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL105428 | 0.77 | MAPT (1.00) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL29392989 | 0.77 | MAPT (1.00) | MEN1KMT2AKDM4ELMNAMAPT | |
| SCHEMBL23654787 | 0.75 | MEN1 (0.44) | MEN1KMT2AKDM4ELMNAMAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4397731-A1 | ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2024-07-10 | — | — | EP | disclosed |
| WO-2023032888-A1 | ADHESIVE, SUBSTRATE HAVING ADHESIVE, CIRCUIT BOARD HAVING ADHESIVE LAYER, LAYERED PRODUCT, METHOD FOR PRODUCING LAYERED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE | 東レ株式会社 | 2023-03-09 | — | — | WO | disclosed |
| US-11186757-B2 | Resin composition, resin layer, permanent adhesive, adhesive for temporary bonding, laminated film, processed wafer, and method for manufacturing electronic component or semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2021-11-30 | — | — | US | disclosed |
| US-20210139700-A1 | RESIN COMPOSITION, RESIN LAYER, PERMANENT ADHESIVE, ADHESIVE FOR TEMPORARY BONDING, LAMINATED FILM, PROCESSED WAFER, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT OR SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2021-05-13 | — | — | US | disclosed |
| US-10941320-B2 | Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion | TORAY INDUSTRIES, INC. (JP) | 2021-03-09 | — | — | US | disclosed |
| EP-3187559-B1 | ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, METHOD FOR MANUFACTURING WAFER WORK PIECE AND SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION | TORAY INDUSTRIES (JP) | 2021-02-17 | — | — | EP | disclosed |
| EP-2902447-B1 | RESIN COMPOSITION, CURED FILM, LAMINATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2020-10-28 | — | — | EP | disclosed |
| US-20190080952-A1 | ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSTION | TORAY INDUSTRIES, INC. (JP) | 2019-03-14 | — | — | US | disclosed |
| US-10177022-B2 | Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition | TORAY INDUSTRIES, INC. (JP) | 2019-01-08 | — | — | US | disclosed |
| US-20180281361-A1 | LAMINATE FILM FOR TEMPORARY BONDING, METHODS FOR PRODUCING SUBSTRATE WORKPIECE AND LAMINATE SUBSTRATE WORKPIECE USING THE LAMINATE FILM FOR TEMPORARY BONDING, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE USING THE SAME | TORAY INDUSTRIES, INC. (JP) | 2018-10-04 | — | — | US | disclosed |
| US-20170221746-A1 | ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION (AS AMENDED) | TORAY INDUSTRIES, INC. (JP) | 2017-08-03 | — | — | US | disclosed |
| US-9716026-B2 | Resin composition, cured film, laminated film, and method for manufacturing semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2017-07-25 | — | — | US | disclosed |
| EP-3187559-A1 | ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, METHOD FOR MANUFACTURING WAFER WORK PIECE AND SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION | Toray Industries, Inc. (JP) | 2017-07-05 | — | — | EP | disclosed |
| EP-3112394-A1 | POLYIMIDE RESIN, RESIN COMPOSITION USING SAME, AND LAMINATED FILM | Toray Industries, Inc. (JP) | 2017-01-04 | — | — | EP | disclosed |
| US-20150228527-A1 | RESIN COMPOSITION, CURED FILM, LAMINATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2015-08-13 | — | — | US | disclosed |
| EP-2902447-A1 | RESIN COMPOSITION, CURED FILM, LAMINATED FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | Toray Industries, Inc. (JP) | 2015-08-05 | — | — | EP | disclosed |
| EP-2735580-A1 | POLYIMIDE RESIN, RESIN COMPOSITION AND LAMINATED FILM THAT USE SAME | Toray Industries, Inc. (JP) | 2014-05-28 | — | — | EP | disclosed |
| EP-1739114-B1 | POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES (JP) | 2008-12-17 | — | — | EP | disclosed |
| US-20070260035-A1 | Polyimide Resin, Laminate Film, Metal Layer-Bearing Laminate Film, and Semiconductor Device | TORAY INDUSTRIES, INC. (JP) | 2007-11-08 | — | — | US | disclosed |
| EP-1739114-A1 | POLYIMIDE RESIN, MULTILAYER FILM, MULTILAYER FILM WITH METAL LAYER, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2007-01-03 | — | — | EP | disclosed |