⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15068448 | 0.68 | MAPT (0.36) | — | |
| SCHEMBL467807 | 0.59 | — | — | |
| SCHEMBL11873236 | 0.50 | ALDH1A1 (0.33) | — | |
| SCHEMBL1135991 | 0.50 | — | — | |
| SCHEMBL29368757 | 0.49 | HTR7 (0.32) | — | |
| SCHEMBL776297 | 0.49 | TSHR (0.38) | — | |
| SCHEMBL7640171 | 0.49 | HSD17B10 (0.32) | — | |
| SCHEMBL6450766 | 0.47 | — | — | |
| SCHEMBL890762 | 0.47 | — | — | |
| Hydrochloric Acid SCHEMBL2701576 | 0.45 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024127112-A1 | COMPOUNDS COMPRISING SULFUR AND (METH)ACRYLATE MOIETIES SUITABLE FOR BONDING ORGANIC POLYMERS TO METAL | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2024-06-20 | — | — | WO | disclosed |
| US-20240141158-A1 | Curable Epoxy Systems Comprising a Phenolic Polymer | RAIN CARBON GERMANY GMBH (DE) | 2024-05-02 | — | — | US | disclosed |
| EP-4288478-A1 | CURABLE EPOXY SYSTEMS COMPRISING A PHENOLIC POLYMER | Rain Carbon Germany GmbH (DE) | 2023-12-13 | — | — | EP | disclosed |
| WO-2023196026-A1 | FORMULATION AND PROCESSING OF DEGRADABLE HIGH Tg EPOXY COMPOSITE THAT CAN BE DEGRADABLE AT EXTREMELY LOW TEMPERATURE | CNPC USA CORPORATION (US) | 2023-10-12 | — | — | WO | disclosed |
| US-20230323015-A1 | Formulation and Processing of Degradable High Tg Epoxy Composite that can be degradable at Extremely Low Temperature | CNPC USA CORPORATION | 2023-10-12 | — | — | US | disclosed |
| US-20230022703-A1 | NOVEL BI-CONTINUOS EPOXY MICROSTRUCTURE FOR FABRICATION OF DEGRADABLE THERMOSET COMPOSITE USED IN HTHP DOWNHOLE CONDITIONS | CNPC USA Corp. | 2023-01-26 | — | — | US | disclosed |
| EP-4004110-A1 | TEMPERATURE STABLE POLYMERIC BLENDS FOR USE IN NON-PNEUMATIC TIRES | Bridgestone Americas Tire Operations, LLC (US) | 2022-06-01 | — | — | EP | disclosed |
| WO-2021021273-A1 | TEMPERATURE STABLE POLYMERIC BLENDS FOR USE IN NON-PNEUMATIC TIRES | BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC (US) | 2021-02-04 | — | — | WO | disclosed |
| US-10899871-B2 | Phosphorous containing epoxy resins and process for synthesis | CHANG CHUN PLASTICS CO., LTD. (TW) | 2021-01-26 | — | — | US | disclosed |
| US-20200339736-A1 | PHOSPHOROUS CONTAINING EPOXY RESINS AND PROCESS FOR SYNTHESIS | CHANG CHUN PLASTICS CO., LTD. (TW) | 2020-10-29 | — | — | US | disclosed |
| EP-1560708-A4 | LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES | AVERY DENNISON CORP (US) | 2007-11-21 | — | — | EP | disclosed |
| EP-1560708-A1 | LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES | AVERY DENNISON CORPORATION (US) | 2005-08-10 | — | — | EP | disclosed |
| US-20040058133-A1 | Labeling method employing two-part curable adhesives | AVERY DENNISON CORPORATION | 2004-03-25 | — | — | US | disclosed |
| WO-2004009348-A1 | LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES | AVERY DENNISON CORPORATION (US) | 2004-01-29 | — | — | WO | disclosed |
| EP-1109850-A1 | PRIMERLESS SUBSTRATE REPAIR COMPOSITION AND METHOD | Lord Corporation (US) | 2001-06-27 | — | — | EP | disclosed |
| US-6153719-A | PHOSPHORUS-CONTAINING COMPOUND HAVING AT LEAST ONE P--OH GROUP AND AT LEAST ONE ORGANIC MOIETY CHARACTERIZED BY THE PRESENCE OF AN ETHYLENICALLY UNSATURATED GROUP;PARTICULARLY USEFUL AS A SEALER FOR AN ADHESIVE JOINT. | LORD CORPORATION (US) | 2000-11-28 | — | — | US | disclosed |
| EP-1053271-A1 | THIOL-CURED EPOXY COMPOSITION | Lord Corporation (US) | 2000-11-22 | — | — | EP | disclosed |
| WO-2000008086-A1 | PRIMERLESS SUBSTRATE REPAIR COMPOSITION AND METHOD | LORD CORPORATION (US) | 2000-02-17 | — | — | WO | disclosed |
| US-5972423-A | METHOD FOR REPAIRING SURFACE OF PLASTIC AUTOMOTIVE VEHICLE PART WITHOUT THE USE OF PRIMER COMPRISING APPLYING CURABLE FILLER COMPOSITION THAT INCLUDES AN EPOXY COMPOUND, POLYTHIOL CURING AGE, AND CATALYST; THEN CURING THE COMPOSITION | LORD CORPORATION (US) | 1999-10-26 | — | — | US | disclosed |
| WO-1999040142-A1 | THIOL-CURED EPOXY COMPOSITION | LORD CORPORATION (US) | 1999-08-12 | — | — | WO | disclosed |