SCHEMBL467563

SCHEMBL467563

SC=CCSc1ccc(SCC=CS)c(SCC=CS)c1SCC=CS

nearest known ligand 0.39

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 1/20 0.39
KMT2A Q03164 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL890762 0.62
SCHEMBL467808 0.59 TRPA1 (0.33)
SCHEMBL29368757 0.59 HTR7 (0.32)
SCHEMBL9885791 0.55
SCHEMBL9945312 0.55
SCHEMBL7109848 0.51
SCHEMBL9118538 0.51 POLB (0.59) MEN1KMT2A
SCHEMBL890650 0.49
SCHEMBL12809694 0.49
SCHEMBL12619651 0.46

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 95 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024127112-A1 COMPOUNDS COMPRISING SULFUR AND (METH)ACRYLATE MOIETIES SUITABLE FOR BONDING ORGANIC POLYMERS TO METAL 3M INNOVATIVE PROPERTIES COMPANY (US) 2024-06-20 WO disclosed
US-20240141158-A1 Curable Epoxy Systems Comprising a Phenolic Polymer RAIN CARBON GERMANY GMBH (DE) 2024-05-02 US disclosed
EP-4288478-A1 CURABLE EPOXY SYSTEMS COMPRISING A PHENOLIC POLYMER Rain Carbon Germany GmbH (DE) 2023-12-13 EP disclosed
US-20230323015-A1 Formulation and Processing of Degradable High Tg Epoxy Composite that can be degradable at Extremely Low Temperature CNPC USA CORPORATION 2023-10-12 US disclosed
WO-2023196026-A1 FORMULATION AND PROCESSING OF DEGRADABLE HIGH Tg EPOXY COMPOSITE THAT CAN BE DEGRADABLE AT EXTREMELY LOW TEMPERATURE CNPC USA CORPORATION (US) 2023-10-12 WO disclosed
US-20230022703-A1 NOVEL BI-CONTINUOS EPOXY MICROSTRUCTURE FOR FABRICATION OF DEGRADABLE THERMOSET COMPOSITE USED IN HTHP DOWNHOLE CONDITIONS CNPC USA Corp. 2023-01-26 US disclosed
EP-4004110-A1 TEMPERATURE STABLE POLYMERIC BLENDS FOR USE IN NON-PNEUMATIC TIRES Bridgestone Americas Tire Operations, LLC (US) 2022-06-01 EP disclosed
WO-2021021273-A1 TEMPERATURE STABLE POLYMERIC BLENDS FOR USE IN NON-PNEUMATIC TIRES BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC (US) 2021-02-04 WO disclosed
US-10899871-B2 Phosphorous containing epoxy resins and process for synthesis CHANG CHUN PLASTICS CO., LTD. (TW) 2021-01-26 US disclosed
US-20200339736-A1 PHOSPHOROUS CONTAINING EPOXY RESINS AND PROCESS FOR SYNTHESIS CHANG CHUN PLASTICS CO., LTD. (TW) 2020-10-29 US disclosed
EP-1560708-A4 LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES AVERY DENNISON CORP (US) 2007-11-21 EP disclosed
EP-1560708-A1 LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES AVERY DENNISON CORPORATION (US) 2005-08-10 EP disclosed
US-20040058133-A1 Labeling method employing two-part curable adhesives AVERY DENNISON CORPORATION 2004-03-25 US disclosed
WO-2004009348-A1 LABELING METHOD EMPLOYING TWO-PART CURABLE ADHESIVES AVERY DENNISON CORPORATION (US) 2004-01-29 WO disclosed
EP-1109850-A1 PRIMERLESS SUBSTRATE REPAIR COMPOSITION AND METHOD Lord Corporation (US) 2001-06-27 EP disclosed
US-6153719-A PHOSPHORUS-CONTAINING COMPOUND HAVING AT LEAST ONE P--OH GROUP AND AT LEAST ONE ORGANIC MOIETY CHARACTERIZED BY THE PRESENCE OF AN ETHYLENICALLY UNSATURATED GROUP;PARTICULARLY USEFUL AS A SEALER FOR AN ADHESIVE JOINT. LORD CORPORATION (US) 2000-11-28 US disclosed
EP-1053271-A1 THIOL-CURED EPOXY COMPOSITION Lord Corporation (US) 2000-11-22 EP disclosed
WO-2000008086-A1 PRIMERLESS SUBSTRATE REPAIR COMPOSITION AND METHOD LORD CORPORATION (US) 2000-02-17 WO disclosed
US-5972423-A METHOD FOR REPAIRING SURFACE OF PLASTIC AUTOMOTIVE VEHICLE PART WITHOUT THE USE OF PRIMER COMPRISING APPLYING CURABLE FILLER COMPOSITION THAT INCLUDES AN EPOXY COMPOUND, POLYTHIOL CURING AGE, AND CATALYST; THEN CURING THE COMPOSITION LORD CORPORATION (US) 1999-10-26 US disclosed
WO-1999040142-A1 THIOL-CURED EPOXY COMPOSITION LORD CORPORATION (US) 1999-08-12 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10899871-B2 Phosphorous containing epoxy resins and process for synthesis PHPT1, EPOR, EED MEN1 4443/4885KMT2A 1149/4885
US-20200339736-A1 PHOSPHOROUS CONTAINING EPOXY RESINS AND PROCESS FOR SYNTHESIS PHPT1, EPOR, EED MEN1 4443/4885KMT2A 1149/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.