⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4740299 | 0.83 | ATM (0.35) | — | |
| SCHEMBL11747317 | 0.82 | HCAR2 (0.39) | — | |
| SCHEMBL4934050 | 0.82 | CES2 (0.35) | — | |
| SCHEMBL2504596 | 0.78 | ALDH1A1 (0.36) | — | |
| SCHEMBL1108022 | 0.78 | THRB (0.44) | — | |
| SCHEMBL4743705 | 0.78 | CYP1A2 (0.33) | — | |
| Ammonia Solution, Strong SCHEMBL7209197 | 0.76 | THRB (0.43) | — | |
| SCHEMBL11747325 | 0.75 | HCAR2 (0.54) | — | |
| SCHEMBL11747341 | 0.75 | HCAR2 (0.54) | — | |
| SCHEMBL14991359 | 0.73 | ALDH1A1 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1558654-A4 | NOVEL COPOLYMER, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEM THEREOF | FUJIFILM ELECTRONIC MATERIALS (US) | 2006-04-05 | — | — | EP | claimed |
| EP-1558654-A2 | NOVEL COPOLYMER, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEM THEREOF | Fujifilm Electronic Materials USA, Inc. (US) | 2005-08-03 | — | — | EP | claimed |
| US-6916543-B2 | Copolymer, photoresist compositions thereof and deep UV bilayer system thereof | ARCH SPECIALTY CHEMICALS, INC. (US) | 2005-07-12 | — | — | US | claimed |
| US-20040137362-A1 | Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof | ARCH SPECIALTY CHEMICALS, INC. | 2004-07-15 | — | — | US | claimed |
| WO-2004040371-A2 | NOVEL COPOLYMER AND PHOTORESIST COMPOSITIONS THEREOF | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-05-13 | — | — | WO | claimed |
| US-20080199805-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS. U.S.A., INC. | 2008-08-21 | — | — | US | disclosed |
| WO-2008098189-A1 | PHOTOSENSITIVE COMPOSITIONS EMPLOYING SILICON-CONTAINING ADDITIVES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-08-14 | — | — | WO | disclosed |
| EP-1558654-A4 | NOVEL COPOLYMER, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEM THEREOF | FUJIFILM ELECTRONIC MATERIALS (US) | 2006-04-05 | — | — | EP | disclosed |
| EP-1558654-A2 | NOVEL COPOLYMER, PHOTORESIST COMPOSITIONS THEREOF AND DEEP UV BILAYER SYSTEM THEREOF | Fujifilm Electronic Materials USA, Inc. (US) | 2005-08-03 | — | — | EP | disclosed |
| US-6916543-B2 | Copolymer, photoresist compositions thereof and deep UV bilayer system thereof | ARCH SPECIALTY CHEMICALS, INC. (US) | 2005-07-12 | — | — | US | disclosed |
| US-20040137362-A1 | Novel copolymer, photoresist compositions thereof and deep UV bilayer system thereof | ARCH SPECIALTY CHEMICALS, INC. | 2004-07-15 | — | — | US | disclosed |
| WO-2004040371-A2 | NOVEL COPOLYMER AND PHOTORESIST COMPOSITIONS THEREOF | ARCH SPECIALTY CHEMICALS, INC. (US) | 2004-05-13 | — | — | WO | disclosed |