Adipic Acid

Adipic Acid

SCHEMBL475382

C(OCC1CO1)C1CO1.O=C(O)CCCCC(=O)O

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Known targets — ChEMBL curated mechanism

SLC18A2SLC6A2SLC6A3

The experimentally established mechanism targets of Adipic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.50
LMNA P02545 2/20 0.46
NFKB1 P19838 1/20 0.44
PMP22 Q01453 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
ALDH1A1 P00352 5/20 0.42
TDP1 Q9NUW8 1/20 0.41
MAPK1 P28482 1/20 0.41
MGLL Q99685 2/20 0.40
SLC22A6 Q4U2R8 1/20 0.40
TP53 P04637 1/20 0.40
CYP3A4 P08684 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Octanedioate SCHEMBL27634532 0.98 TSHR (0.48) TSHRLMNANFKB1PMP22SMN1; SMN2
Azelaic Acid SCHEMBL27634510 0.98 TSHR (0.48) TSHRLMNANFKB1PMP22SMN1; SMN2
Sebacic Acid SCHEMBL11139033 0.98 TSHR (0.48) TSHRLMNANFKB1PMP22SMN1; SMN2
Glutarate SCHEMBL27633876 0.96 TSHR (0.50) TSHRLMNANFKB1PMP22SMN1; SMN2
Succinic Acid SCHEMBL27818706 0.91 TSHR (0.48) TSHRLMNASMN1; SMN2ALDH1A1TDP1
Octanoic Acid SCHEMBL9233254 0.89 ALDH1A1 (0.59) TSHRSMN1; SMN2ALDH1A1TDP1SLC22A6
Decanoic Acid SCHEMBL27807530 0.89 ALDH1A1 (0.59) TSHRSMN1; SMN2ALDH1A1TDP1SLC22A6
Palmitic Acid SCHEMBL28990447 0.89 ALDH1A1 (0.59) TSHRSMN1; SMN2ALDH1A1TDP1SLC22A6
Stearic Acid SCHEMBL7600941 0.89 ALDH1A1 (0.59) TSHRSMN1; SMN2ALDH1A1TDP1SLC22A6
Myristic Acid SCHEMBL28052805 0.89 ALDH1A1 (0.59) TSHRSMN1; SMN2ALDH1A1TDP1SLC22A6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 397 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111218093-A Room-temperature curing two-component potting material with excellent electrical property and good moisture resistance 天津瑞宏汽车配件制造有限公司 2020-06-02 CN claimed
CN-109988531-A SLA die surface step patching material and preparation method thereof 西安增材制造国家研究院有限公司 2019-07-09 CN claimed
CN-105062395-A Two-component epoxy glue and preparation method thereof Guangzhou baiyun chemical industry co ltd 2015-11-18 CN claimed
CN-102492263-A Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof Guangzhou baiyun chemical industry co ltd 2012-06-13 CN claimed
US-20110015285-A1 FOAMABLE COPOLYMERS BASED ON RENEWABLE RAW MATERIALS BASF SE (DE) 2011-01-20 US claimed
US-6162510-A Method of manufacturing a color filter CANON KABUSHIKI KAISHA (JP) 2000-12-19 US claimed
US-6084006-A HEAT HARDENABLE MIXTURES OF COLORING MATERIALS, ACRYLIC RESINS AND THERMOSETTING RESINS CONTAINING MULTIFUNCTIONAL EPOXIDES HAVING AT LEAST TWO GLYCIDYL GROUPS, ALSO FOR LIQUID CRYSTAL DISPLAYS CANON KABUSHIKI KAISHA (JP) 2000-07-04 US claimed
US-20240242854-A1 OXYGEN AND MOISTURE BARRIER COMPOSITIONS AND RELATED METHODS US GOVERNMENT AS REPRESENTED BY THE SECRETARY OF THE ARMY 2024-07-18 US disclosed
EP-4397623-A1 EPOXY GROUP-CONTAINING ORGANOSILICA SOL, EPOXY RESIN COMPOSITION AND PRODUCTION METHOD THEREOF Nissan Chemical Corporation (JP) 2024-07-10 EP disclosed
US-11961636-B2 Silica-containing insulating composition NISSAN CHEMICAL CORPORATION (JP) 2024-04-16 US disclosed
CN-117881628-A Epoxy group-containing organosilicon sol, epoxy resin composition, and method for producing same 日产化学株式会社 2024-04-12 CN disclosed
US-11945984-B2 Reinforcing film NITTO DENKO CORPORATION (JP) 2024-04-02 US disclosed
CN-114213631-B Resin toughening composition, resin toughening modifier, modified bismaleimide resin composition and cured product 洛阳尖端技术研究院 2024-02-06 CN disclosed
EP-0816899-A2 Color filter and black resist composition MITSUBISHI CHEMICAL CORPORATION (JP) 1998-01-07 EP disclosed
CN-1132775-A Adhesive resin composition and laminate thereof and production process of laminate SHOWA DENKO KK (JP) 1996-10-09 CN disclosed
US-5547711-A FROM ALKOXYSILANE COMPOUNDS CONTAINING PERFLUOROALKYL GROUPS BAYER AKTIENGESELLSCHAFT (DE) 1996-08-20 US disclosed
CN-1067441-A EPOXY RESIN POWDER COATING COMPOSITION SHELL INT RESEARCH (NL) 1992-12-30 CN disclosed
US-5124074-A Reaction product of a mono-capped polyoxyalkylene glycol and a polyepoxy compound MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1992-06-23 US disclosed
US-4368237-A ORGANIC SOLVENT-FREE FUJI PHOTO FILM CO., LTD. (JP) 1983-01-11 US disclosed
US-4010289-A METHOD OF MANUFACTURING SYNTHETIC RESIN FILM HAVING HIGH WRITABILITY AND PRINTABILITY SHOWA DENKO KABUSHIKI KAISHA (JA) 1977-03-01 US disclosed