SCHEMBL475578

SCHEMBL475578

C=COC1CCC2OC2C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10117430 0.83
SCHEMBL592212 0.78
SCHEMBL9859429 0.78
SCHEMBL521223 0.77
Acrylic Acid SCHEMBL31550544 0.75 LMNA (0.33)
SCHEMBL65094 0.72
SCHEMBL804962 0.72
SCHEMBL14415207 0.72
SCHEMBL15310077 0.71
SCHEMBL14528800 0.71 KDM4E (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 60 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119698449-A Adhesive film 东山薄膜株式会社 2025-03-25 CN disclosed
CN-115141551-B Pressure-sensitive adhesive sheet 索马龙株式会社 2024-11-12 CN disclosed
CN-118652553-A Self-repairing double-component organic silicon heat-conducting gel and preparation method thereof 深圳市嘉多宝科技有限公司 2024-09-17 CN disclosed
WO-2024135432-A1 ADHESIVE FILM 東山フイルム株式会社 2024-06-27 WO disclosed
CN-118146751-A Adhesive composition, adhesive sheet, optical member, and display device 日本电石工业株式会社 2024-06-07 CN disclosed
CN-118055991-A Adhesive material and adhesive sheet 大塚化学株式会社 2024-05-17 CN disclosed
CN-118055990-A Adhesive material and adhesive sheet 东山薄膜株式会社 2024-05-17 CN disclosed
CN-115066331-B Adhesive material, adhesive sheet, and flexible laminate member 东山薄膜株式会社 2024-05-07 CN disclosed
CN-116948553-A Pressure-sensitive adhesive sheet 索马龙株式会社 2023-10-27 CN disclosed
CN-114728507-B Adhesive material, adhesive sheet, and flexible laminate member 大塚化学株式会社 2023-10-10 CN disclosed
EP-1251118-B1 UNSATURATED MONOCARBOXYLIC ESTER COMPOUND, PROCESS FOR PRODUCING THE SAME, AND COMPOSITION CURABLE WITH ACTINIC ENERGY RAY UNIV KANAGAWA (JP) 2006-12-20 EP disclosed
CN-1267399-C Unsaturated monocarboxylic ester compound, method for producing same, and active energy ray-curable composition UNIV KANAGAWA (JP) 2006-08-02 CN disclosed
US-7057063-B2 Unsaturated carboxylic ester compound, process for producing the same, and composition curable with actinic energy ray KANAGAWA UNIVERSITY (JP) 2006-06-06 US disclosed
US-20060030636-A1 Unsaturated carboxylic ester compound, process for producing the same, and composition curable with actinic energy ray KANAGAWA UNIVERSITY 2006-02-09 US disclosed
CN-1396902-A Unsaturated monocarboxylic ester compound, method for producing same, and active energy ray-curable composition UNIV KANAGAWA (JP) 2003-02-12 CN disclosed
US-20030009053-A1 Unsaturated monocarboxylic ester compound, process for producing the same, and composition curable with actinic energy ray KANAGAWA UNIVERSITY (JP) 2003-01-09 US disclosed
EP-1251118-A1 UNSATURATED MONOCARBOXYLIC ESTER COMPOUND, PROCESS FOR PRODUCING THE SAME, AND COMPOSITION CURABLE WITH ACTINIC ENERGY RAY Kanagawa University (JP) 2002-10-23 EP disclosed
US-6197907-B1 LOW MOLECULAR WEIGHT HAVING A VERY LITTLE ODOR IS PRODUCED BY EMULSION-POLYMERIZING A RADICAL-POLYMERIZABLE UNSATURATED MONOMER AT A TEMPERATURE OF 115 DEGREES C. OR HIGHER IN THE PRESENCE OR ABSENCE OF A CHAIN TRANSFER AGENT. NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 2001-03-06 US disclosed
EP-0931795-A1 POLYMER OBTAINED BY EMULSION POLYMERIZATION METHOD NIPPON CARBIDE KOGYO KABUSHIKI KAISHA (JP) 1999-07-28 EP disclosed
US-5445871-A Laminate; cured film of an actinic-radiation curable primer; an inorganic material layer formed on cured film by physical deposition KANSAI PAINT CO., LTD. (JP) 1995-08-29 US disclosed