SCHEMBL475957

SCHEMBL475957

C[Si](C)(C)O[Si](C)(CCCCN)CCCCN

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NFKB1 P19838 1/20 0.35
DNM1 Q05193 9/20 0.33
CA12 O43570 2/20 0.33
CA1 P00915 2/20 0.33
CA2 P00918 2/20 0.33
CA3 P07451 2/20 0.33
CA4 P22748 2/20 0.33
CA6 P23280 2/20 0.33
CA5A P35218 2/20 0.33
CA7 P43166 2/20 0.33
CA9 Q16790 2/20 0.33
CA14 Q9ULX7 2/20 0.33
CA5B Q9Y2D0 2/20 0.33
TSHR P16473 2/20 0.33
LMNA P02545 1/20 0.33
BLM P54132 1/20 0.33
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
ALDH1A1 P00352 1/20 0.32
ODC1 P11926 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31367933 0.98 DNM1 (0.38) NFKB1DNM1CA12CA1CA2
SCHEMBL31367940 0.98 DNM1 (0.38) NFKB1DNM1CA12CA1CA2
SCHEMBL31367929 0.98 DNM1 (0.38) NFKB1DNM1CA12CA1CA2
SCHEMBL10994040 0.98 DNM1 (0.38) NFKB1DNM1CA12CA1CA2
SCHEMBL31367932 0.98 DNM1 (0.38) NFKB1DNM1CA12CA1CA2
SCHEMBL31367931 0.98 DNM1 (0.38) NFKB1DNM1CA12CA1CA2
SCHEMBL240359 0.92 ODC1 (0.33) NFKB1ODC1
SCHEMBL9221215 0.81
SCHEMBL14722128 0.81
SCHEMBL449036 0.80 NFKB1 (0.35) NFKB1DNM1CA12CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 425 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240425649-A1 SILICON POLYMER AND PREPARATION METHOD THEREFOR AND USE THEREOF Longway Technology (Guangzhou) Co., Ltd. (CN) 2024-12-26 US claimed
CN-118373991-A Polyimide with high silicon content and preparation method and application thereof 深圳市摩码克来沃化学科技有限公司 2024-07-23 CN claimed
CN-118027402-A Corona-resistant polyimide, preparation method thereof and insulated wire 深圳市摩码克来沃化学科技有限公司 2024-05-14 CN claimed
CN-115073732-B Block type photosensitive polyimide precursor resin, preparation method thereof and block type photosensitive resin composition 波米科技有限公司 2023-06-02 CN claimed
CN-114805810-B Photosensitive polyimide precursor resin, preparation method and photosensitive resin composition 波米科技有限公司 2023-06-02 CN claimed
CN-115073732-A Block type photosensitive polyimide precursor resin, preparation method thereof and block type photosensitive resin composition 波米科技有限公司 2022-09-20 CN claimed
CN-114805810-A Photosensitive polyimide precursor resin, preparation method thereof and photosensitive resin composition 波米科技有限公司 2022-07-29 CN claimed
US-7928155-B2 Compositions and methods for polymer composites SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2011-04-19 US claimed
EP-2032611-A2 COMPOSITIONS AND METHODS FOR POLYMER COMPOSITES Sabic Innovative Plastics IP B.V. (NL) 2009-03-11 EP claimed
EP-1937774-A2 BLENDS OF POLY ARYL ETHER KETONES AND POLYETHERIMIDE SULFONES General Electric Company (US) 2008-07-02 EP claimed
WO-2008002891-A2 COMPOSITIONS AND METHODS FOR POLYMER COMPOSITES SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2008-01-03 WO claimed
US-20070299189-A1 COMPOSITIONS AND METHODS FOR POLYMER COMPOSITES SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2007-12-27 US claimed
WO-2007035402-A2 IMPROVED POLY ARYL ETHER KETONE POLYMER BLENDS GENERAL ELECTRIC COMPANY (US) 2007-03-29 WO claimed
US-20070066765-A1 Polyarlyl ether ketone polymer blends GENERAL ELECTRIC COMPANY (US) 2007-03-22 US claimed
WO-1998051435-A1 FULLY-COATED, UNIFORM-SIZED METALLIC PARTICLES TANG WEIXIN (US) 1998-11-19 WO claimed
EP-0195402-B1 BIS(HYDROXYPHTHALIMIDE) AND PROCESS FOR PREPARING THE SAME, AND PROCESS FOR PREPARING POLYESTERIMIDE BY THE USE THEREOF NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1992-06-10 EP claimed
US-20250291248-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN LAYER AND SEMICONDUCTOR DEVICE USING THE SAME SAMSUNG SDI CO., LTD. (KR) 2025-09-18 US disclosed
CN-112771447-B Positive photosensitive resin composition, photosensitive resin film using the same, and electronic device 三星SDI株式会社 2025-06-03 CN disclosed
US-3968083-A Novel polyetherimides GENERAL ELECTRIC COMPANY (US) 1976-07-06 US disclosed
US-3944517-A Novel polyetherimides prepared from tolane dianhydride or dichloroethylene diphenylene dianhydride GENERAL ELECTRIC COMPANY (US) 1976-03-16 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20240425649-A1 SILICON POLYMER AND PREPARATION METHOD THEREFOR AND USE THEREOF CUTA, OR51E2, PCNA NFKB1 3933/4885DNM1 1587/4885CA12 2076/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.