SCHEMBL4807229

SCHEMBL4807229

OC(CN1CCOCC1)CC(F)(F)C(F)(F)C(F)(F)C(F)(F)F

nearest known ligand 0.56

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
USP2 O75604 2/20 0.56
ATM Q13315 1/20 0.39
KDM4E B2RXH2 1/20 0.39
L3MBTL1 Q9Y468 2/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
HSD17B10 Q99714 1/20 0.38
CYP2D6 P10635 1/20 0.38
GAA P10253 1/20 0.38
MAPK1 P28482 1/20 0.38
POLB P06746 1/20 0.38
KMT2A Q03164 2/20 0.37
TSHR P16473 3/20 0.37
MEN1 O00255 1/20 0.36
PKM P14618 1/20 0.36
ALDH1A1 P00352 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13985573 0.98 USP2 (0.55) USP2ATMKDM4EL3MBTL1SMN1; SMN2
SCHEMBL13985580 0.89 USP2 (0.51) USP2ATMKDM4EL3MBTL1SMN1; SMN2
SCHEMBL13985574 0.89 USP2 (0.55) USP2ATMKDM4EL3MBTL1SMN1; SMN2
SCHEMBL17165980 0.88 USP2 (0.53) USP2ATMKDM4EL3MBTL1SMN1; SMN2
SCHEMBL15025112 0.81 USP2 (0.49) USP2ATMKDM4EL3MBTL1SMN1; SMN2
SCHEMBL13980438 0.79 USP2 (0.55) USP2ATMKDM4EL3MBTL1SMN1; SMN2
SCHEMBL15025355 0.79 USP2 (0.50) USP2ATMKDM4EL3MBTL1SMN1; SMN2
SCHEMBL13985575 0.79 ALDH1A1 (0.45) USP2ATMKDM4ESMN1; SMN2HSD17B10
SCHEMBL4806264 0.79 USP2 (0.36) USP2KDM4ESMN1; SMN2TSHRALDH1A1
SCHEMBL13985576 0.78 ALDH1A1 (0.44) USP2ATMKDM4ESMN1; SMN2HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2602660-B1 Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film SHINETSU CHEMICAL CO (JP) 2019-03-20 EP disclosed
US-9158191-B2 Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-10-13 US disclosed
US-9158191-B2 Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2015-10-13 US disclosed
US-20130149493-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-06-13 US disclosed
US-20130149493-A1 CHEMICALLY AMPLIFIED NEGATIVE RESIST COMPOSITION, PHOTO-CURABLE DRY FILM, MAKING METHOD, PATTERN FORMING PROCESS, AND ELECTRIC/ELECTRONIC PART PROTECTING FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2013-06-13 US disclosed
EP-2602660-A1 Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film Shin-Etsu Chemical Co., Ltd. (JP) 2013-06-12 EP disclosed
US-7468236-B2 Amine compound, chemically amplified resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-12-23 US disclosed
US-7468236-B2 Amine compound, chemically amplified resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2008-12-23 US disclosed
US-20070087287-A1 Amine compound, chemically amplified resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2007-04-19 US disclosed
US-20070087287-A1 Amine compound, chemically amplified resist composition and patterning process SHIN-ETSU CHEMICAL CO., LTD. 2007-04-19 US disclosed