SCHEMBL48078

SCHEMBL48078

COc1ccc(Cc2ccccc2OC(=O)Oc2ccccc2Cc2ccc(OC)cc2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ATM Q13315 2/20 0.55
L3MBTL1 Q9Y468 2/20 0.55
TDP1 Q9NUW8 1/20 0.55
LTA4H P09960 1/20 0.51
SLC5A1 P13866 4/20 0.50
SLC5A2 P31639 4/20 0.50
SAE1 Q9UBE0 1/20 0.46
UBA2 Q9UBT2 1/20 0.46
MAPT P10636 2/20 0.46
CYP1A2 P05177 2/20 0.46
CYP2C9 P11712 2/20 0.46
CYP2C19 P33261 2/20 0.46
CYP3A4 P08684 1/20 0.46
ALDH1A1 P00352 2/20 0.45
MTNR1A P48039 1/20 0.45
MTNR1B P49286 1/20 0.45
MAOB P27338 1/20 0.45
ABCB1 P08183 1/20 0.44
HPGD P15428 1/20 0.44
LMNA P02545 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL48079 0.89 LTA4H (0.54) ATML3MBTL1TDP1LTA4HSLC5A1
SCHEMBL1717105 0.89 ATM (0.54) ATML3MBTL1TDP1LTA4HSLC5A1
SCHEMBL7282070 0.83 LTA4H (0.62) ATML3MBTL1TDP1LTA4HSLC5A1
SCHEMBL5478146 0.83 HPGD (0.50) L3MBTL1CYP1A2CYP2C9CYP3A4HPGD
SCHEMBL13324839 0.83 KMT2A (0.51) ATML3MBTL1TDP1LTA4HSLC5A1
SCHEMBL13324837 0.82 KMT2A (0.50) ATML3MBTL1TDP1LTA4HSLC5A1
SCHEMBL5284234 0.82 LTA4H (0.60) ATML3MBTL1TDP1LTA4HSLC5A1
SCHEMBL28860367 0.81 HPGD (0.45) L3MBTL1CYP1A2CYP2C9CYP3A4HPGD
SCHEMBL13656566 0.80 KMT2A (0.48) ATML3MBTL1TDP1SLC5A1SLC5A2
SCHEMBL12404363 0.80 LMNA (0.49) ATML3MBTL1TDP1LTA4HMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2149586-B1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE MITSUBISHI GAS CHEMICAL CO (JP) 2018-01-03 EP disclosed
US-8128782-B2 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2012-03-06 US disclosed
US-20100160494-A1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE MITSUBISHI GAS CHEMICAL COMPANY INC. (JP) 2010-06-24 US disclosed
EP-2149586-A1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE Mitsubishi Gas Chemical Company, Inc. (JP) 2010-02-03 EP disclosed