SCHEMBL48079

SCHEMBL48079

COc1ccc(Cc2ccccc2OC(=O)O)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LTA4H P09960 1/20 0.54
ATM Q13315 1/20 0.54
TDP1 Q9NUW8 1/20 0.54
L3MBTL1 Q9Y468 1/20 0.54
SLC5A1 P13866 4/20 0.49
SLC5A2 P31639 4/20 0.49
ALDH1A1 P00352 2/20 0.47
ABCB1 P08183 1/20 0.47
USP2 O75604 1/20 0.46
TP53 P04637 1/20 0.46
SAE1 Q9UBE0 1/20 0.45
UBA2 Q9UBT2 1/20 0.45
LDHA P00338 1/20 0.45
MMP2 P08253 1/20 0.45
MMP8 P22894 1/20 0.45
MMP12 P39900 1/20 0.45
MMP13 P45452 1/20 0.45
MMP14 P50281 1/20 0.45
MMP16 P51512 1/20 0.45
CYP1A2 P05177 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL48078 0.89 ATM (0.55) LTA4HATMTDP1L3MBTL1SLC5A1
SCHEMBL1717105 0.88 ATM (0.54) LTA4HATMTDP1L3MBTL1SLC5A1
SCHEMBL5478147 0.85 HPGD (0.50) L3MBTL1TP53CYP1A2CYP3A4CYP2C9
SCHEMBL7282070 0.82 LTA4H (0.62) LTA4HATMTDP1L3MBTL1SLC5A1
SCHEMBL13324839 0.82 KMT2A (0.51) LTA4HATMTDP1L3MBTL1SLC5A1
SCHEMBL13324837 0.81 KMT2A (0.50) LTA4HATMTDP1L3MBTL1SLC5A1
SCHEMBL5284234 0.80 LTA4H (0.60) LTA4HATMTDP1L3MBTL1SLC5A1
SCHEMBL10338678 0.80 TSHR (0.41) L3MBTL1ALDH1A1TP53MAPTCYP2C9
SCHEMBL13656566 0.79 KMT2A (0.48) ATMTDP1L3MBTL1SLC5A1SLC5A2
SCHEMBL12404363 0.79 LMNA (0.49) LTA4HATMTDP1L3MBTL1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2149586-B1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE MITSUBISHI GAS CHEMICAL CO (JP) 2018-01-03 EP disclosed
CN-101679611-B Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate MITSUBISHI GAS CHEMICAL CO 2013-01-09 CN disclosed
US-8128782-B2 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2012-03-06 US disclosed
US-20100160494-A1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE MITSUBISHI GAS CHEMICAL COMPANY INC. (JP) 2010-06-24 US disclosed
CN-101679611-A Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate MITSUBISHI GAS CHEMICAL CO 2010-03-24 CN disclosed
EP-2149586-A1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE Mitsubishi Gas Chemical Company, Inc. (JP) 2010-02-03 EP disclosed