SCHEMBL4816185

SCHEMBL4816185

CC(C)(C)c1cc(/C=C/C(=O)NCCCCCCNC(=O)/C=C/c2cc(C(C)(C)C)c(O)c(C(C)(C)C)c2O)c(O)c(C(C)(C)C)c1O

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GAA P10253 1/20 0.47
EGFR P00533 1/20 0.44
APP P05067 2/20 0.41
PYGL P06737 4/20 0.41
HDAC3 O15379 2/20 0.41
HDAC4 P56524 2/20 0.41
HDAC1 Q13547 2/20 0.41
HDAC7 Q8WUI4 2/20 0.41
HDAC2 Q92769 2/20 0.41
HDAC10 Q969S8 2/20 0.41
HDAC11 Q96DB2 2/20 0.41
HDAC8 Q9BY41 2/20 0.41
HDAC6 Q9UBN7 2/20 0.41
HDAC9 Q9UKV0 2/20 0.41
HDAC5 Q9UQL6 2/20 0.41
TYR P14679 1/20 0.41
KMT2A Q03164 1/20 0.40
ESR1 P03372 1/20 0.40
ESR2 Q92731 1/20 0.40
BCHE P06276 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7668323 0.81 GABBR2 (0.56) GAAEGFRAPPPYGLBCHE
SCHEMBL2119406 0.81 GABBR2 (0.56) GAAEGFRAPPPYGLBCHE
SCHEMBL28419451 0.78 GABBR2 (0.43) GAAEGFRTYRKMT2A
SCHEMBL6937641 0.78 GABBR2 (0.46) GAATYRKMT2AESR1ESR2
SCHEMBL10807980 0.78 GABBR2 (0.46) GAATYRKMT2AESR1ESR2
SCHEMBL17152142 0.77 EGFR (0.60) GAAEGFRAPPBCHEMAOA
SCHEMBL28072581 0.74 APP (0.50) EGFRAPPPYGLHDAC3HDAC1
SCHEMBL17152151 0.73 EGFR (0.55) GAAEGFRAPPPYGLESR1
SCHEMBL28529805 0.73 GABBR2 (0.52) GAAAPPBCHEMAOAACHE
SCHEMBL27082259 0.72 GAA (0.61) GAAKMT2ABCHEMAOAACHE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-5001223-A None JP disclosed
WO-2024157988-A1 HOT-MELT ADHESIVE COMPOSITION 株式会社クラレ 2024-08-02 WO disclosed
US-11017918-B2 Semi-conductive composition for power cable DYM SOLUTION CO., LTD. (KR) 2021-05-25 US disclosed
US-20190180889-A1 SEMI-CONDUCTIVE COMPOSITION FOR POWER CABLE DYM SOLUTION CO., LTD. (KR) 2019-06-13 US disclosed
US-20150225541-A1 POLYAMIDE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-08-13 US disclosed
EP-2891684-A1 POLYAMIDE RESIN COMPOSITION AND METHOD FOR PRODUCING SAME Mitsubishi Gas Chemical Company, Inc. (JP) 2015-07-08 EP disclosed
US-7324259-B2 Display element KONICA MINOLTA HOLDINGS, INC. (JP) 2008-01-29 US disclosed
US-20050213186-A1 Display element KONICA MINOLTA HOLDINGS, INC. 2005-09-29 US disclosed
JP-H051223-A POLYAMIDE RESIN COMPOSITION OF EXCELLENT LIGHT RESISTANCE SHOWA DENKO KK 1993-01-08 JP disclosed
US-4983454-A CATIONIC ELECTRODEPOSITION, THERMOPLASTIC RESIN BARRIER COATING KANSAI PAINT CO., LTD. (JP) 1991-01-08 US disclosed
US-4789566-A MULTILAYER-ELECTROCOATING (AINT, CROSSLINKING HARDENABLE RESIN , AND OVERCOATING KANSAI PAINT CO., LTD. (JP) 1988-12-06 US disclosed
US-4756975-A Applying cationic electrodeposition paint to metal surfaces, applying modified polyolefin barrier coat to metal and plastic surfaces, applying top coating paint KANSAI PAINT CO., LTD. (JP) 1988-07-12 US disclosed
US-4755434-A Applying cationic electrodeposition paint, barrier layer of modified polyolefin and corrosion preventive pigment, top coating paint KANSAI PAINT CO., LTD. (JP) 1988-07-05 US disclosed
US-4755435-A Applying cationic electrodeposition paint, barrier layer of modified polyolefin, top coating paint KANSAI PAINT CO., LTD. (JP) 1988-07-05 US disclosed