SCHEMBL482596

SCHEMBL482596

CCCCNC(=O)Nc1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(NC(=O)NCCCC)c2F)c1F

nearest known ligand 0.55

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 5/20 0.55
POLB P06746 1/20 0.42
SMN1; SMN2 Q16637 3/20 0.39
RECQL P46063 1/20 0.39
L3MBTL1 Q9Y468 1/20 0.39
MAPT P10636 2/20 0.38
RAB9A P51151 2/20 0.38
NPC1 O15118 1/20 0.38
MITF O75030 1/20 0.38
KMT2A Q03164 1/20 0.38
EPHX1 P07099 4/20 0.37
ALDH1A1 P00352 2/20 0.36
HPGD P15428 1/20 0.36
HTT P42858 2/20 0.36
ATM Q13315 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL483182 0.87 SMN1; SMN2 (0.52) EPHX2POLBSMN1; SMN2RECQLMAPT
SCHEMBL482899 0.85 ALDH1A1 (0.39) EPHX2POLBL3MBTL1MAPTALDH1A1
SCHEMBL9800073 0.84 RECQL (0.39) EPHX2POLBSMN1; SMN2RECQLMAPT
SCHEMBL28741272 0.84 EPHX2 (0.40) EPHX2SMN1; SMN2L3MBTL1MAPTNPC1
SCHEMBL6663241 0.83 EPHX2 (0.32) EPHX2SMN1; SMN2
SCHEMBL482917 0.83 EP300 (0.41) EPHX2SMN1; SMN2L3MBTL1MAPTKMT2A
SCHEMBL483155 0.82 ALDH1A1 (0.38) EPHX2POLBKMT2AALDH1A1HTT
SCHEMBL5201048 0.82 ALDH1A1 (0.40) EPHX2ALDH1A1
SCHEMBL483279 0.82 ALPL (0.38) EPHX2POLBSMN1; SMN2MAPTKMT2A
SCHEMBL482664 0.81 ALDH1A1 (0.42) EPHX2POLBNPC1KMT2AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
CN-113168093-A Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2021-07-23 CN disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 EP disclosed
EP-1471387-B1 Photosensitive composition and compound used thereof FUJIFILM CORP (JP) 2015-11-11 EP disclosed
EP-0949540-B1 Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition FUJIFILM CORP (JP) 2012-05-02 EP disclosed
EP-1249731-B1 Photosensitive composition and negative working lithographic printing plate FUJIFILM CORP (JP) 2012-04-25 EP disclosed
EP-1249731-A2 Photosensitive composition and negative working lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2002-10-16 EP disclosed
EP-1238801-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2002-09-11 EP disclosed
EP-0860741-B1 Photopolymerizable composition FUJI PHOTO FILM CO LTD (JP) 2001-05-16 EP disclosed
EP-1091247-A2 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 2001-04-11 EP disclosed
US-6153660-A VERY HIGH SENSITIVITY TO BEAMS IN THE VISIBLE REGION, PARTICULARLY TO VISIBLE RAYS AT 400 NM OR MORE SUCH AS RAYS AT 488 NM OR 532 NM CORRESPONDING TO THE OUTPUT OF AR+ LASER OR YAG-SHG LASER FUJI PHOTO FILM CO., LTD. (JP) 2000-11-28 US disclosed
US-6051367-A COMPRISING ONE OR MORE ADDITION-POLYMERIZABLE ETHYLENICALLY UNSATURATED COMPOUNDS AND A SPECIFIC OXIME ETHER COMPOUND; HIGH SENSITIVE TO ACTINIC RAYS RANGING FROM ULTRAVIOLET TO VISIBLE LIGHT, IMPROVED FILM STRENGTH FUJI PHOTO FILM CO., LTD. (JP) 2000-04-18 US disclosed
EP-0949540-A1 Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition FUJI PHOTO FILM CO., LTD (JP) 1999-10-13 EP disclosed
EP-0924570-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1999-06-23 EP disclosed
EP-0860741-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-08-26 EP disclosed
US-5026625-A Photoinitiators for polymerization of ethylenically unsaturated compounds CIBA-GEIGY CORPORATION (US) 1991-06-25 US disclosed