Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EPHX2 | P34913 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | BACE1 | P56817 | 1/20 | 0.31 |
| ▸ | HCAR3 | P49019 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28741308 | 0.95 | EPHX2 (0.38) | EPHX2HCAR3 | |
| SCHEMBL28741265 | 0.95 | EPHX2 (0.38) | EPHX2HCAR3 | |
| SCHEMBL17237546 | 0.85 | — | — | |
| SCHEMBL482596 | 0.83 | EPHX2 (0.55) | EPHX2SMN1; SMN2 | |
| SCHEMBL29104864 | 0.82 | IGFBP3 (0.34) | — | |
| SCHEMBL28608349 | 0.81 | — | — | |
| SCHEMBL29104887 | 0.81 | — | — | |
| SCHEMBL6662490 | 0.81 | IDO1 (0.31) | — | |
| SCHEMBL23854465 | 0.81 | — | — | |
| SCHEMBL29104875 | 0.81 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3893054-B1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORP (JP) | 2026-05-06 | — | — | EP | disclosed |
| US-12393116-B2 | Pattern forming method, photosensitive resin composition, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2025-08-19 | — | — | US | disclosed |
| EP-3893053-B1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM CORP (JP) | 2025-01-22 | — | — | EP | disclosed |
| US-12078929-B2 | Photosensitive resin composition, pattern forming method, cured film, laminate, and device | FUJIFILM CORPORATION (JP) | 2024-09-03 | — | — | US | disclosed |
| EP-3893054-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| EP-3893053-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE | FUJIFILM Corporation (JP) | 2021-10-13 | — | — | EP | disclosed |
| US-20210302836-A1 | PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| US-20210302835-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE | FUJIFILM CORPORATION (JP) | 2021-09-30 | — | — | US | disclosed |
| EP-1091247-B1 | Photopolymerizable composition | FUJI PHOTO FILM CO LTD (JP) | 2004-08-25 | — | — | EP | disclosed |
| US-6476092-B1 | Photopolymerizable composition containing a polymerizable acrylic compound with hetero-substituted methyl or halo-substituted methyl at the alpha position | FUJI PHOTO FILM CO., LTD. (JP) | 2002-11-05 | — | — | US | disclosed |
| EP-1091247-A2 | Photopolymerizable composition | FUJI PHOTO FILM CO., LTD. (JP) | 2001-04-11 | — | — | EP | disclosed |
| US-6153660-A | VERY HIGH SENSITIVITY TO BEAMS IN THE VISIBLE REGION, PARTICULARLY TO VISIBLE RAYS AT 400 NM OR MORE SUCH AS RAYS AT 488 NM OR 532 NM CORRESPONDING TO THE OUTPUT OF AR+ LASER OR YAG-SHG LASER | FUJI PHOTO FILM CO., LTD. (JP) | 2000-11-28 | — | — | US | disclosed |
| EP-0924570-A1 | Photopolymerizable composition | FUJI PHOTO FILM CO., LTD. (JP) | 1999-06-23 | — | — | EP | disclosed |