SCHEMBL482777

SCHEMBL482777

C#CCCc1[c]cccc1

nearest known ligand 0.35

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
MITF O75030 1/20 0.35
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
ALDH1A1 P00352 1/20 0.31
CYP3A4 P08684 1/20 0.31
ALOX15 P16050 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8728336 0.88 CYP3A4 (0.36) MITFMEN1KMT2AALDH1A1CYP3A4
SCHEMBL216358 0.79
SCHEMBL3118969 0.79 MEN1 (0.42) MEN1KMT2A
SCHEMBL483063 0.78
SCHEMBL614113 0.76
SCHEMBL2528409 0.75 MAOA (0.31)
SCHEMBL3450884 0.75 HTR2A (0.30)
SCHEMBL614588 0.75
SCHEMBL11863151 0.73 SIGMAR1 (0.32)
SCHEMBL267285 0.72 ATM (0.44) MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 551 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110446739-B Fluoroacetophenone-containing derivative, fluorine-containing additive, curable composition containing the same, and cured product thereof DIC株式会社 2022-01-11 CN disclosed
US-10961405-B2 Fluorine-containing acetophenone derivative, fluroine based additive, curable composition including same, and cured product thereof DIC CORPORATION (JP) 2021-03-30 US disclosed
CN-111954849-A Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member DIC株式会社 2020-11-17 CN disclosed
CN-110446739-A Fluorine-containing acetophenone derivs, fluorine system additive and contain its solidification compound and its solidfied material DAINIPPON INK & CHEMICALS 2019-11-12 CN disclosed
WO-2019198489-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS AND RESIST MEMBER DIC株式会社 2019-10-17 WO disclosed
CN-106414398-B Compound, active energy ray-curable composition, cured product thereof, printing ink, and ink for inkjet recording DIC株式会社 2019-04-05 CN disclosed
EP-1657286-B1 Radiation curable ink jet ink, comprising a polymerisation initiation sensitising dye FUJIFILM CORP (JP) 2018-07-04 EP disclosed
US-9957402-B2 Compound, active energy ray curable composition, cured article thereof, printing ink, and inkjet recording ink DIC CORPORATION (JP) 2018-05-01 US disclosed
EP-1859954-B2 Planographic printing plate precursor and stack thereof FUJIFILM CORP (JP) 2017-11-08 EP disclosed
EP-2042921-B1 Pigment dispersion composition, photocurable composition and color filter FUJIFILM CORP (JP) 2017-10-25 EP disclosed
EP-0924570-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1999-06-23 EP disclosed
EP-0922570-A2 Planographic printing plate precursor and a method for producing a planographic plate Fuji Photo Film Co., Ltd. (JP) 1999-06-16 EP disclosed
US-5837748-A THIAZOLYLIDENE DERIVATIVE PHOTOINITIATOR; VISIBLE LIGHT PHOTOSENSITIVITY; PRINTING PLATES FUJI PHOTO FILM CO., LTD. (JP) 1998-11-17 US disclosed
EP-0860741-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-08-26 EP disclosed
US-5721288-A FOR UNSATURATED COMPOUNDS FUJI PHOTO FILM CO., LTD. (JP) 1998-02-24 US disclosed
EP-0822447-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-02-04 EP disclosed
US-5703140-A CONTAINS ETHYLENICALLY UNSATURATED BOND, OXIME ETHER COMPOUND, SPECTRAL SENSITIZING DYE FUJI PHOTO FILM CO., LTD. (JP) 1997-12-30 US disclosed
EP-0726497-A2 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1996-08-14 EP disclosed
EP-0726498-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1996-08-14 EP disclosed
EP-0724197-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1996-07-31 EP disclosed