SCHEMBL4830565

SCHEMBL4830565

CCOCCOCCOC(C)CC

nearest known ligand 0.37

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.36
TSHR P16473 1/20 0.34
LMNA P02545 1/20 0.33
THRB P10828 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13599724 1.00 ALDH1A1 (0.36) ALDH1A1TSHRLMNATHRBTDP1
SCHEMBL13843583 1.00 ALDH1A1 (0.36) ALDH1A1TSHRLMNATHRBTDP1
SCHEMBL13588494 0.97 ALDH1A1 (0.38) ALDH1A1TSHRLMNATHRBTDP1
SCHEMBL1476547 0.92 TDP1 (0.33) LMNATDP1
SCHEMBL1476765 0.92 TDP1 (0.33) LMNATDP1
SCHEMBL13380879 0.85 TDP1 (0.43) TDP1
SCHEMBL4837958 0.85 TDP1 (0.30) TDP1
SCHEMBL4830601 0.85 TDP1 (0.43) TDP1
SCHEMBL1476871 0.84 LMNA (0.37) TSHRLMNATHRBTDP1
SCHEMBL13599725 0.83 CA2 (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102898149-A Solvent or solvent composition for manufacturing laminated ceramic member DAICEL CHEM 2013-01-30 CN disclosed
CN-102731112-A Solvent or solvent composition for producing laminated ceramic component DAICEL FINECHEM LTD 2012-10-17 CN disclosed
CN-1760757-B Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO 2010-11-10 CN disclosed
CN-1760758-B Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO 2010-11-03 CN disclosed
US-7538147-B2 Image forming method, pattern forming method and liquid-applying apparatus which make use of liquid compositions CANON KABUSHIKI KAISHA (JP) 2009-05-26 US disclosed
US-7528179-B2 Block polymer, polymer-containing composition containing the same, ink composition and liquid applying method and liquid applying apparatus utilizing the polymer-containing composition CANON KABUSHIKI KAISHA (JP) 2009-05-05 US disclosed
US-7338737-B2 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-04 US disclosed
US-7297452-B2 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-20 US disclosed
US-20070254221-A1 Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. SAMSUNG DISPLAY CO., LTD. (KR) 2007-11-01 US disclosed
US-20060141393-A1 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. 2006-06-29 US disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed
CN-1760757-A Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO (JP) 2006-04-19 CN disclosed
CN-1760758-A Radioactivity sensitive resin composition SUMITOMO CHEMICAL CO (JP) 2006-04-19 CN disclosed