SCHEMBL483067

SCHEMBL483067

O=C(c1ccccc1Cl)N(c1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(N(C(=O)c3ccccc3Cl)C3CCCCC3)c2F)c1F)C1CCCCC1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HPGD P15428 1/20 0.45
TSHR P16473 1/20 0.45
ALDH1A1 P00352 6/20 0.39
SLC6A9 P48067 1/20 0.38
SLC6A5 Q9Y345 1/20 0.38
HTT P42858 4/20 0.34
MAPT P10636 3/20 0.34
NPSR1 Q6W5P4 3/20 0.34
SMN1; SMN2 Q16637 2/20 0.33
GAA P10253 1/20 0.33
SLC6A2 P23975 1/20 0.33
SLC6A4 P31645 1/20 0.33
SLC6A3 Q01959 1/20 0.33
POLB P06746 2/20 0.32
LMNA P02545 3/20 0.32
KDM4E B2RXH2 2/20 0.31
NPC1 O15118 2/20 0.31
RAB9A P51151 2/20 0.31
PAX8 Q06710 2/20 0.31
APAF1 O14727 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL269339 0.87 ALDH1A1 (0.39) ALDH1A1HTTMAPTNPSR1SMN1; SMN2
SCHEMBL482529 0.86 SLC6A9 (0.38) ALDH1A1SLC6A9SLC6A5HTTNPSR1
SCHEMBL21044990 0.81 HPGD (0.46) HPGDTSHRALDH1A1SLC6A9SLC6A5
SCHEMBL5199709 0.78
SCHEMBL7763186 0.78 MEN1 (0.32) SLC6A2SLC6A4SLC6A3MEN1KMT2A
SCHEMBL5666818 0.78 RIPK1 (0.34) GAA
SCHEMBL483228 0.78 TP53 (0.36) HPGDALDH1A1LMNANPC1RAB9A
SCHEMBL27482480 0.77 HPGD (0.52) HPGDTSHRALDH1A1SLC6A9SLC6A5
SCHEMBL482927 0.77
SCHEMBL483047 0.77 POLB (0.38) HTTMAPTGAAPOLBLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-20210302836-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
CN-113168093-A Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2021-07-23 CN disclosed
US-20030190554-A1 Photopolymerization; development using alkalinity developer FUJIFILM CORPORATION (JP) 2003-10-09 US disclosed
EP-1341040-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 2003-09-03 EP disclosed
US-20030091933-A1 Photosensitive composition and negative working lithographic printing plate FUJIFILM CORPORATION (JP) 2003-05-15 US disclosed
US-20030084806-A1 FINE PARTICLES CONTAINING A RADICAL POLYMERIZABLE ENCAPSULATED BY MICROCAPSULES FUJIFILM CORPORATION (JP) 2003-05-08 US disclosed
EP-1288720-A1 Plate-making method of printing plate FUJI PHOTO FILM CO., LTD. (JP) 2003-03-05 EP disclosed
US-6476092-B1 Photopolymerizable composition containing a polymerizable acrylic compound with hetero-substituted methyl or halo-substituted methyl at the alpha position FUJI PHOTO FILM CO., LTD. (JP) 2002-11-05 US disclosed
EP-1249731-A2 Photosensitive composition and negative working lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2002-10-16 EP disclosed
EP-1238801-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2002-09-11 EP disclosed
EP-1091247-A2 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 2001-04-11 EP disclosed
US-5026625-A Photoinitiators for polymerization of ethylenically unsaturated compounds CIBA-GEIGY CORPORATION (US) 1991-06-25 US disclosed