SCHEMBL483150

SCHEMBL483150

CCc1[c]ccc(P(=O)(O)O)c1CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7987969 0.75 TRPA1 (0.31)
SCHEMBL125379 0.72 GABRA1 (0.30)
SCHEMBL1965156 0.70
SCHEMBL18261805 0.69 GABRA1 (0.32)
SCHEMBL3818858 0.69
SCHEMBL8348913 0.69 NOS3 (0.36)
SCHEMBL107782 0.68 CYP1A2 (0.37)
SCHEMBL1537947 0.68 GABRA1 (0.45)
SCHEMBL7020614 0.68 POLB (0.38)
SCHEMBL8104758 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 468 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110446739-B Fluoroacetophenone-containing derivative, fluorine-containing additive, curable composition containing the same, and cured product thereof DIC株式会社 2022-01-11 CN disclosed
US-10961405-B2 Fluorine-containing acetophenone derivative, fluroine based additive, curable composition including same, and cured product thereof DIC CORPORATION (JP) 2021-03-30 US disclosed
CN-111954849-A Photosensitive resin composition, cured product, insulating material, resin material for solder resist, and resist member DIC株式会社 2020-11-17 CN disclosed
WO-2019198489-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESISTS AND RESIST MEMBER DIC株式会社 2019-10-17 WO disclosed
EP-1657286-B1 Radiation curable ink jet ink, comprising a polymerisation initiation sensitising dye FUJIFILM CORP (JP) 2018-07-04 EP disclosed
US-9957402-B2 Compound, active energy ray curable composition, cured article thereof, printing ink, and inkjet recording ink DIC CORPORATION (JP) 2018-05-01 US disclosed
EP-1859954-B2 Planographic printing plate precursor and stack thereof FUJIFILM CORP (JP) 2017-11-08 EP disclosed
EP-2042921-B1 Pigment dispersion composition, photocurable composition and color filter FUJIFILM CORP (JP) 2017-10-25 EP disclosed
EP-2006738-B1 Lithographic printing plate precursor FUJIFILM CORP (JP) 2017-09-06 EP disclosed
EP-1975707-B1 Curable composition and planographic printing plate precursor FUJIFILM CORP (JP) 2017-07-19 EP disclosed
EP-0860741-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-08-26 EP disclosed
EP-0710887-B1 Photopolymerizable composition FUJI PHOTO FILM CO LTD (JP) 1998-07-29 EP disclosed
US-5721288-A FOR UNSATURATED COMPOUNDS FUJI PHOTO FILM CO., LTD. (JP) 1998-02-24 US disclosed
EP-0822447-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-02-04 EP disclosed
US-5703140-A CONTAINS ETHYLENICALLY UNSATURATED BOND, OXIME ETHER COMPOUND, SPECTRAL SENSITIZING DYE FUJI PHOTO FILM CO., LTD. (JP) 1997-12-30 US disclosed
US-5609992-A UNSATURATED COMPOUND AND A THIAZOLONE PHOTOSENSITIZER FUJI PHOTO FILM CO., LTD. (JP) 1997-03-11 US disclosed
EP-0726497-A2 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1996-08-14 EP disclosed
EP-0726498-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1996-08-14 EP disclosed
EP-0724197-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1996-07-31 EP disclosed
EP-0710887-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1996-05-08 EP disclosed