SCHEMBL483181

SCHEMBL483181

CC(C)C(=O)Nc1ccc(F)c([Ti](C2=CC=CC2)(C2=CC=CC2)c2c(F)ccc(NC(=O)C(C)C)c2F)c1F

nearest known ligand 0.40

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 1/20 0.40
MDM4 O15151 2/20 0.38
TP53 P04637 2/20 0.38
KDM4E B2RXH2 2/20 0.36
LMNA P02545 1/20 0.34
MDM2 Q00987 1/20 0.34
GAA P10253 1/20 0.34
RECQL P46063 2/20 0.33
CETP P11597 1/20 0.33
EPHX2 P34913 4/20 0.33
MAPT P10636 1/20 0.32
KDR P35968 1/20 0.32
POLB P06746 2/20 0.32
MEN1 O00255 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP2C9 P11712 1/20 0.32
CYP2C19 P33261 1/20 0.32
KMT2A Q03164 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL482840 0.89 KDM4E (0.39) NPC1KDM4ELMNAGAAEPHX2
SCHEMBL482664 0.87 ALDH1A1 (0.42) NPC1KDM4EEPHX2POLBMEN1
SCHEMBL483113 0.87 GAA (0.45) NPC1KDM4ELMNAGAAEPHX2
SCHEMBL483069 0.86 HDAC1 (0.39) NPC1KDM4ELMNAGAAEPHX2
SCHEMBL269422 0.83 PDK1 (0.34) NPC1EPHX2MEN1KMT2A
SCHEMBL483279 0.83 ALPL (0.38) TP53KDM4ELMNAEPHX2MAPT
SCHEMBL483079 0.83 HTT (0.47) NPC1TP53KDM4EEPHX2
SCHEMBL483118 0.83 KDM4E (0.35) NPC1KDM4ECETPEPHX2POLB
SCHEMBL482825 0.82 KMT2A (0.49) NPC1TP53KDM4ELMNAGAA
SCHEMBL483289 0.82 RECQL (0.39) NPC1TP53LMNAGAARECQL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
CN-113383273-A Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2021-09-10 CN disclosed
CN-113168093-A Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2021-07-23 CN disclosed
US-20210197447-A1 Method for Making an Object PHOTOCENTRIC LIMITED (GB) 2021-07-01 US disclosed
EP-3492982-B1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2020-11-11 EP disclosed
EP-3492982-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, METHOD FOR PRODUCING LAMINATE, AND SEMICONDUCTOR DEVICE FUJIFILM Corporation (JP) 2019-06-05 EP disclosed
EP-3295246-B1 METHOD FOR MAKING AN OBJECT PHOTOCENTRIC LTD (GB) 2019-05-01 EP disclosed
US-20180141268-A1 Method for Making an Object PHOTOCENTRIC LIMITED (GB) 2018-05-24 US disclosed
US-20030091933-A1 Photosensitive composition and negative working lithographic printing plate FUJIFILM CORPORATION (JP) 2003-05-15 US disclosed
US-20030084806-A1 FINE PARTICLES CONTAINING A RADICAL POLYMERIZABLE ENCAPSULATED BY MICROCAPSULES FUJIFILM CORPORATION (JP) 2003-05-08 US disclosed
EP-1288720-A1 Plate-making method of printing plate FUJI PHOTO FILM CO., LTD. (JP) 2003-03-05 EP disclosed
EP-1249731-A2 Photosensitive composition and negative working lithographic printing plate FUJI PHOTO FILM CO., LTD. (JP) 2002-10-16 EP disclosed
EP-1238801-A2 Lithographic printing plate precursor FUJI PHOTO FILM CO., LTD. (JP) 2002-09-11 EP disclosed
EP-0860741-B1 Photopolymerizable composition FUJI PHOTO FILM CO LTD (JP) 2001-05-16 EP disclosed
US-6051367-A COMPRISING ONE OR MORE ADDITION-POLYMERIZABLE ETHYLENICALLY UNSATURATED COMPOUNDS AND A SPECIFIC OXIME ETHER COMPOUND; HIGH SENSITIVE TO ACTINIC RAYS RANGING FROM ULTRAVIOLET TO VISIBLE LIGHT, IMPROVED FILM STRENGTH FUJI PHOTO FILM CO., LTD. (JP) 2000-04-18 US disclosed
EP-0949540-A1 Method for producing lithographic printing plate suitable for laser scan exposure, and photopolymerizable composition FUJI PHOTO FILM CO., LTD (JP) 1999-10-13 EP disclosed
EP-0860741-A1 Photopolymerizable composition FUJI PHOTO FILM CO., LTD. (JP) 1998-08-26 EP disclosed
US-5026625-A Photoinitiators for polymerization of ethylenically unsaturated compounds CIBA-GEIGY CORPORATION (US) 1991-06-25 US disclosed