SCHEMBL48329

SCHEMBL48329

Nc1ccc(Cc2ccc(N)c(Cl)c2Cl)c(Cl)c1Cl

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 6/20 0.39
ALDH1A1 P00352 5/20 0.38
MAPT P10636 4/20 0.38
MEN1 O00255 3/20 0.38
KMT2A Q03164 3/20 0.38
TDP1 Q9NUW8 2/20 0.38
POLB P06746 2/20 0.38
RAB9A P51151 2/20 0.38
BLM P54132 2/20 0.38
NPC1 O15118 1/20 0.38
THRB P10828 1/20 0.38
APEX1 P27695 1/20 0.38
RECQL P46063 1/20 0.38
MCL1 Q07820 1/20 0.38
L3MBTL1 Q9Y468 1/20 0.38
TSHR P16473 5/20 0.35
ALOX15 P16050 3/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
IMPDH2 P12268 1/20 0.33
MAPK1 P28482 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29987755 1.00 CYP3A4 (0.39) CYP3A4ALDH1A1MAPTMEN1KMT2A
SCHEMBL11680707 0.84 GAA (0.44) CYP3A4ALDH1A1MAPTTDP1THRB
SCHEMBL11228666 0.84 CYP3A4 (0.44) CYP3A4ALDH1A1MAPTMEN1KMT2A
SCHEMBL11678925 0.84 GAA (0.44) CYP3A4ALDH1A1MAPTTDP1THRB
SCHEMBL9701629 0.83 CYP3A4 (0.50) CYP3A4ALDH1A1MAPTMEN1KMT2A
SCHEMBL17069845 0.80 ALDH1A1 (0.35) CYP3A4ALDH1A1MAPTMEN1KMT2A
SCHEMBL21852155 0.80 POLB (0.40) CYP3A4ALDH1A1MAPTMEN1KMT2A
SCHEMBL11678565 0.80 CYP3A4 (0.38) CYP3A4ALDH1A1TDP1THRBRECQL
SCHEMBL526351 0.80 ALDH1A1 (0.50) CYP3A4ALDH1A1MAPTMEN1KMT2A
SCHEMBL11412578 0.78 ALDH1A1 (0.34) CYP3A4ALDH1A1MAPTMEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1556 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4098400-B1 POLISHING PAD AND METHOD FOR PREPARING A SEMICONDUCTOR DEVICE USING THE SAME ENPULSE CO LTD (KR) 2026-04-22 EP claimed
US-20260091462-A1 PAD FOR CHEMICAL MECHANICAL POLISHING DUPONT ELECTRONIC MAT HOLDING INC (US) 2026-04-02 US claimed
US-12570029-B2 Method for manufacturing polishing pad window, and polishing pad window manufactured thereby KPX Chemical Co., Ltd (KR) 2026-03-10 US claimed
US-12515295-B2 Polishing pad and method for preparing a semiconductor device using the same ENPULSE CO., LTD. (KR) 2026-01-06 US claimed
US-20250250460-A1 COATING KIT AND METHOD FOR REPAIR AND/OR RECONSTITUTION OF RUBBER AND/OR METAL WORN AREAS BERTECH PANAMA S.A. (PA) 2025-08-07 US claimed
US-20250222556-A1 PAD FOR CHEMICAL MECHANICAL POLISHING U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION, AS NOTES COLLATERAL AGENT 2025-07-10 US claimed
EP-4467286-A1 METHOD FOR MANUFACTURING POLISHING PAD WINDOW, AND POLISHING PAD WINDOW MANUFACTURED THEREBY KPX Chemical Co., Ltd. (KR) 2024-11-27 EP claimed
US-20240367356-A1 METHOD FOR MANUFACTURING POLISHING PAD WINDOW, AND POLISHING PAD WINDOW MANUFACTURED THEREBY KPX CHEMICAL CO., LTD. (KR) 2024-11-07 US claimed
WO-2024052724-A1 COATING KIT AND METHOD FOR REPAIR AND/OR RECONSTITUTION OF RUBBER AND/OR METAL WORN AREAS BERTECH PANAMÁ S.A. (PA) 2024-03-14 WO claimed
CN-117396308-A Method of manufacturing a polishing pad window and polishing pad window manufactured thereby 韩商KPX化学股份有限公司 2024-01-12 CN claimed
US-5312651-A Using varnish from /1/ brominated 3-functional epoxy resin consisting of bisphenol A epoxy resin, specified triglycidyl ether, tetrabromobisphenol A, /2/ dicyandiamide and chloro diaminodiphenylmethane curing agent, /3/ an imidazole catalyst MATSUSHITA ELECTRIC WORKS, LTD. (JP) 1994-05-17 US claimed
EP-0579989-A1 Polyurethaneurea elastomer IHARA CHEMICAL INDUSTRY Co., Ltd. (JP) 1994-01-26 EP claimed
EP-0279376-B1 Process for producing polyurea resin IHARA CHEMICAL IND CO (JP) 1993-11-03 EP claimed
US-5039775-A Process for producing polyurea resin IHARA CHEMICAL INDUSTRY CO., LTD. (JP) 1991-08-13 US claimed
EP-0161576-B1 EPOXY RESIN COMPOSITION SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1990-07-04 EP claimed
US-4869961-A NONTOXIC HANDLING IHARA CHEMICAL IND. CO., LTD. (JP) 1989-09-26 US claimed
US-4663401-A POLYSULFONE POLYETHER BLEND WITH DIAMINE CURING AGENT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1987-05-05 US claimed
EP-0161576-A2 Epoxy resin composition SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1985-11-21 EP claimed
US-4327204-A Process for producing polyurethane elastomer by mixing a hardener composition with an isocyanate composition IHARA CHEMICAL INDUSTRY CO., LTD. (JP) 1982-04-27 US claimed
US-4107151-A FROM POLYISOCYANATE, CHAIN POLYOL, AROMATIC DIAMINE, POLYOL OR AMINO ALCOHOL WITH URETHANE BOND IHARA CHEMICAL COMPANY CO., LTD. (JP) 1978-08-15 US claimed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260091462-A1 PAD FOR CHEMICAL MECHANICAL POLISHING PCNA, PUF60, PADI2 CYP3A4 4807/4885ALDH1A1 2050/4885MAPT 1411/4885
US-12570029-B2 Method for manufacturing polishing pad window, and polishing pad window manufactured thereby PRKDC, PRKACB, PRKX CYP3A4 3717/4885ALDH1A1 2177/4885MAPT 2174/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.