SCHEMBL4837555

SCHEMBL4837555

CO[Si](C)(OC)OCCCC(N)CCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27891951 0.78 ODC1 (0.38)
SCHEMBL28150470 0.76
SCHEMBL4654326 0.76 NFKB1 (0.33)
SCHEMBL9699808 0.74 DNM1 (0.36)
SCHEMBL9699818 0.74 DNM1 (0.36)
SCHEMBL27995263 0.74 LMNA (0.33)
SCHEMBL9698384 0.74 DNM1 (0.36)
SCHEMBL9698404 0.74 DNM1 (0.36)
SCHEMBL9699649 0.74 DNM1 (0.36)
SCHEMBL9698473 0.74 DNM1 (0.36)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118050964-A Carrier, developer, method and apparatus for electrophotographic image formation 株式会社理光 2024-05-17 CN disclosed
CN-113286859-B Curable resin composition and cured body 积水化学工业株式会社 2023-08-04 CN disclosed
CN-113302249-B Photo-moisture curable resin composition and cured body 积水化学工业株式会社 2023-07-07 CN disclosed
CN-1808273-B Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD 2012-12-26 CN disclosed
CN-1800981-B Photosensitive resin composition, thin film panel made with photosensitive composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD 2010-12-01 CN disclosed
CN-101470382-A Charging member cleaning unit, method of producing charging member cleaning unit, charging device, process cartridge and image forming apparatus FUJI XEROX CO LTD (JP) 2009-07-01 CN disclosed
US-7338737-B2 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-04 US disclosed
US-7297452-B2 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-20 US disclosed
US-20070254221-A1 Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. SAMSUNG DISPLAY CO., LTD. (KR) 2007-11-01 US disclosed
CN-1808273-A Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD (KR) 2006-07-26 CN disclosed
CN-1800981-A Photosensitive resin composition, thin film panel made with photosensitive composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO LTD (KR) 2006-07-12 CN disclosed
US-20060141393-A1 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. 2006-06-29 US disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed