Di(Hydroxyethyl)Ether

Di(Hydroxyethyl)Ether

SCHEMBL4838775

CCCOC(C)(C)C.OCCOCCO

nearest known ligand 0.52

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Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.52
MAPK1 P28482 3/20 0.48
MEN1 O00255 3/20 0.46
KMT2A Q03164 3/20 0.46
THRB P10828 1/20 0.46
HTT P42858 1/20 0.46
MAPT P10636 1/20 0.46
ALDH1A1 P00352 2/20 0.46
CYP4F2 P78329 1/20 0.34
CYP4A11 Q02928 1/20 0.34
USP2 O75604 1/20 0.32
LMNA P02545 1/20 0.32
CYP3A4 P08684 1/20 0.32
CASP1 P29466 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32
SLCO1B3 Q9NPD5 1/20 0.32
SLCO1B1 Q9Y6L6 1/20 0.32
HSD17B10 Q99714 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Di(Hydroxyethyl)Ether SCHEMBL8528937 0.92 ALDH1A1 (0.50) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL8528943 0.91 MEN1 (0.48) TSHRMAPK1MEN1KMT2ATHRB
Ethylene Glycol SCHEMBL8858006 0.87 TSHR (0.35) TSHRMAPK1MEN1KMT2ATHRB
Propanol SCHEMBL11142726 0.87 TSHR (0.35) TSHRMAPK1MEN1KMT2ATHRB
Di(Hydroxyethyl)Ether SCHEMBL4838428 0.86 TSHR (0.67) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL967075 0.85 MEN1 (0.58) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL10389811 0.85 MEN1 (0.58) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL4140630 0.85 MEN1 (0.58) TSHRMAPK1MEN1KMT2ATHRB
SCHEMBL81017 0.85 MEN1 (0.58) TSHRMAPK1MEN1KMT2ATHRB
Di(Hydroxyethyl)Ether SCHEMBL27892743 0.85 MEN1 (0.63) TSHRMAPK1MEN1KMT2ATHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-102898149-A Solvent or solvent composition for manufacturing laminated ceramic member DAICEL CHEM 2013-01-30 CN disclosed
CN-102731112-A Solvent or solvent composition for producing laminated ceramic component DAICEL FINECHEM LTD 2012-10-17 CN disclosed
US-7338737-B2 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-03-04 US disclosed
US-7297452-B2 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-11-20 US disclosed
US-20070254221-A1 Akali-soluble resin, quinone diazide, surfactant mixture of a 3-perfluoroalkylpropane epoxide and polyethersilicones), and a solvent; high-quality display panels with uniformly-coated insulating layers. SAMSUNG DISPLAY CO., LTD. (KR) 2007-11-01 US disclosed
US-20060141393-A1 Alkali-soluble resin; a quinone diazide; and a mixture of surfactants including a 3-(perfluoroalkyl)-1,2-epoxypropane, reaction product between methylhydrobis(trimethylsiloxy)silane and polyalkylene glycol monoallyl ether preferably having a molecular weight from 200 to 500 and a 2nd ether silicone SAMSUNG ELECTRONICS CO., LTD. 2006-06-29 US disclosed
US-20060131267-A1 Photosensitive resin composition, thin film panel made with photosensitive resin composition, and method for manufacturing thin film panel SAMSUNG DISPLAY CO., LTD. (KR) 2006-06-22 US disclosed