SCHEMBL48441

SCHEMBL48441

CC(CCCN(C)C)OC(=O)OC(C)CCCN(C)C

nearest known ligand 0.35

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MBTD1 Q05BQ5 1/20 0.35
L3MBTL3 Q96JM7 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
FAAH O00519 5/20 0.35
USP2 O75604 1/20 0.35
ALDH1A1 P00352 5/20 0.35
LMNA P02545 2/20 0.35
TSHR P16473 1/20 0.35
HTR2A P28223 1/20 0.34
HRH1 P35367 1/20 0.34
CNR1 P21554 1/20 0.34
CNR2 P34972 1/20 0.34
CHRM2 P08172 1/20 0.33
CHRM4 P08173 1/20 0.33
CHRM5 P08912 1/20 0.33
CHRM1 P11229 1/20 0.33
CHRNB2 P17787 1/20 0.33
CHRM3 P20309 1/20 0.33
CHRNA4 P43681 1/20 0.33
HPGD P15428 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL48442 0.86 MBTD1 (0.38) MBTD1L3MBTL3L3MBTL1FAAHUSP2
SCHEMBL8399782 0.82 CA12 (0.35) MBTD1L3MBTL3L3MBTL1FAAHALDH1A1
SCHEMBL8399781 0.80 FAAH (0.39) FAAHALDH1A1LMNACNR1CNR2
SCHEMBL8395380 0.79 FAAH (0.45) L3MBTL1FAAHALDH1A1LMNACNR1
SCHEMBL8394687 0.79 FAAH (0.45) L3MBTL1FAAHALDH1A1LMNACNR1
SCHEMBL8399814 0.78 FAAH (0.46) FAAHALDH1A1LMNACNR1CNR2
Hydrochloric Acid SCHEMBL8399760 0.77 LMNA (0.39) L3MBTL1FAAHALDH1A1LMNACNR1
SCHEMBL8399144 0.77 FAAH (0.35) FAAHALDH1A1CNR1CNR2
SCHEMBL12026665 0.77 MBTD1 (0.33) MBTD1L3MBTL3L3MBTL1FAAHUSP2
Hydrochloric Acid SCHEMBL8398588 0.76 FAAH (0.43) FAAHALDH1A1LMNATSHRCNR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2149586-B1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE MITSUBISHI GAS CHEMICAL CO (JP) 2018-01-03 EP disclosed
US-8128782-B2 Amine epoxy resin curing agent, gas barrier epoxy resin composition comprising the curing agent, coating agent, and adhesive agent for laminate MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2012-03-06 US disclosed
US-20100160494-A1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE MITSUBISHI GAS CHEMICAL COMPANY INC. (JP) 2010-06-24 US disclosed
EP-2149586-A1 AMINE EPOXY RESIN CURING AGENT, GAS BARRIER EPOXY RESIN COMPOSITION COMPRISING THE CURING AGENT, COATING AGENT, AND ADHESIVE AGENT FOR LAMINATE Mitsubishi Gas Chemical Company, Inc. (JP) 2010-02-03 EP disclosed