SCHEMBL4853450

SCHEMBL4853450

OC1(O)CCC(Cl)CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12971036 0.73 TSHR (0.46)
SCHEMBL7019540 0.72 ALDH1A1 (0.31)
SCHEMBL14372530 0.71 ATP1A1 (0.34)
SCHEMBL20134669 0.69
SCHEMBL1001696 0.69 SMN1; SMN2 (0.32)
SCHEMBL4353023 0.67 GRM2 (0.37)
SCHEMBL25287713 0.67
SCHEMBL753505 0.67
SCHEMBL4069109 0.67
SCHEMBL23263231 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 67 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1382437-B1 Thermal conductive polymer molded article and method for producing the same POLYMATECH CO LTD (JP) 2012-09-12 EP disclosed
US-7347955-B2 Thermoconductive molecular oriented liquid crystal polymers used as heat exchanger in electronics POLYMATECH CO., LTD. (JP) 2008-03-25 US disclosed
US-7189778-B2 Thermally conductive polymer molded article and method for producing the same POLYMATECH CO., LTD. (JP) 2007-03-13 US disclosed
US-7079405-B2 Thermal conductive polymer molded article and method for producing the same POLYMATECH CO., LTD. (JP) 2006-07-18 US disclosed
EP-1416031-B1 Heat conducting polymer mold products POLYMATECH CO LTD (JP) 2006-05-24 EP disclosed
US-20040152829-A1 Thermally conductive polymer molded article and method for producing the same POLYMATECH CO., LTD. (JP) 2004-08-05 US disclosed
US-20040087697-A1 Heat conducting polymer mold products POLYMATECH CO., LTD. (JP) 2004-05-06 US disclosed
EP-1416031-A1 Heat conducting polymer mold products Polymatech Co., Ltd. (JP) 2004-05-06 EP disclosed
US-20040048054-A1 Thermal conductive polymer molded article and method for producing the same POLYMATECH CO., LTD. (JP) 2004-03-11 US disclosed
EP-0264290-B2 Composition for injection moulding POLYPLASTICS CO (JP) 2004-03-03 EP disclosed
EP-0236116-A1 Motor rotor POLYPLASTICS CO. LTD. (JP) 1987-09-09 EP disclosed
EP-0231606-A2 Polyester composition POLYPLASTICS CO. LTD. (JP) 1987-08-12 EP disclosed
EP-0226361-A1 Electrically conductive resin composition POLYPLASTICS CO. LTD. (JP) 1987-06-24 EP disclosed
EP-0214827-A2 Surface-metallized, moulded resin article POLYPLASTICS CO. LTD. (JP) 1987-03-18 EP disclosed
EP-0206599-A2 Magnetic disk POLYPLASTICS CO. LTD. (JP) 1986-12-30 EP disclosed
EP-0206600-A2 Method for molding a gear wheel POLYPLASTICS CO. LTD. (JP) 1986-12-30 EP disclosed
US-4626371-A ANISOTROPIC POLYMERS CELANESE CORPORATION (US) 1986-12-02 US disclosed
EP-0178836-A2 Optical disc POLYPLASTICS CO. LTD. (JP) 1986-04-23 EP disclosed
EP-0175535-A1 Magnetic composite POLYPLASTICS CO. LTD. (JP) 1986-03-26 EP disclosed
EP-0155070-A1 Coated optical fiber, fabrication process thereof and fabrication apparatus thereof NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1985-09-18 EP disclosed