SCHEMBL4854802

SCHEMBL4854802

C[S+](Cc1ccccc1)c1ccccc1.F[B-](F)(F)F

nearest known ligand 0.36

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TP53 P04637 1/20 0.36
CALM1 P0DP23 1/20 0.33
TAAR1 Q96RJ0 3/20 0.32
ACHE P22303 1/20 0.32
ALDH1A1 P00352 5/20 0.32
TSHR P16473 3/20 0.32
KDM4E B2RXH2 2/20 0.31
TDP1 Q9NUW8 1/20 0.31
CYP3A4 P08684 1/20 0.31
MAPT P10636 1/20 0.31
IDO1 P14902 1/20 0.31
LOXL2 Q9Y4K0 1/20 0.31
TRPA1 O75762 1/20 0.31
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31
MAOA P21397 1/20 0.30
SLC6A2 P23975 1/20 0.30
SLC6A4 P31645 1/20 0.30
SLC6A3 Q01959 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1127762 0.91 TP53 (0.42) TP53CALM1TAAR1ALDH1A1TSHR
SCHEMBL4852324 0.87 MMP3 (0.42) TDP1MEN1KMT2ASLC6A2SLC6A3
SCHEMBL9241379 0.84 LTA4H (0.49) ACHEALDH1A1KDM4ETDP1MEN1
SCHEMBL390922 0.80 TP53 (0.40) TP53CALM1TAAR1ALDH1A1TSHR
SCHEMBL8757718 0.80 TP53 (0.40) TP53CALM1TAAR1ALDH1A1TSHR
SCHEMBL13400453 0.79 HTT (0.42) TP53ACHEALDH1A1TSHRKDM4E
SCHEMBL9357293 0.78 CALM1 (0.36) TP53CALM1TAAR1ALDH1A1TSHR
SCHEMBL5693416 0.78 TSHR (0.39) TP53CALM1TAAR1ALDH1A1TSHR
SCHEMBL9241421 0.78 GAA (0.47) ALDH1A1TSHRKDM4ETDP1MAPT
SCHEMBL13146728 0.78 CYP1A2 (0.43) TAAR1ALDH1A1TSHRTDP1MAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7371500-B2 Positive photosensitive insulating resin composition and cured product thereof JSR CORPORATION (JP) 2008-05-13 US claimed
US-20070166632-A1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORPORATION (JP) 2007-07-19 US claimed
EP-1469346-B1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM JSR CORP (JP) 2015-08-05 EP disclosed
US-7371500-B2 Positive photosensitive insulating resin composition and cured product thereof JSR CORPORATION (JP) 2008-05-13 US disclosed
US-20070166632-A1 POSITIVE PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED PRODUCT THEREOF JSR CORPORATION (JP) 2007-07-19 US disclosed
US-7214454-B2 Positively photosensitive insulating resin composition and cured object obtained therefrom JSR CORPORATION (JP) 2007-05-08 US disclosed
US-7015256-B2 Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same JSR CORPORATION (JP) 2006-03-21 US disclosed
EP-1471540-A1 COMPOSITION FOR FORMING PHOTOSENSITIVE DIELECTRIC MATERIAL, AND TRANSFER FILM, DIELECTRIC MATERIAL AND ELECTRONIC PARTS USING THE SAME JSR Corporation (JP) 2004-10-27 EP disclosed
EP-1469346-A1 POSITIVELY PHOTOSENSITIVE INSULATING RESIN COMPOSITION AND CURED OBJECT OBTAINED THEREFROM JSR Corporation (JP) 2004-10-20 EP disclosed
US-20040126696-A1 Positively photosensitive insulating resin composition and cured object obtained therefrom JSR CORPORATION (JP) 2004-07-01 US disclosed
US-20040094752-A1 Composition for forming photosensitive dielectric material, and transfer film, dielectric material and electronic parts using the same JSR CORPORATION (JP) 2004-05-20 US disclosed