SCHEMBL4865335

SCHEMBL4865335

C=CC(Oc1ccc(OC(C=C)c2ccccc2)cc1)c1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
SRD5A2 P31213 1/20 0.42
SLC7A5 Q01650 7/20 0.38
SLC6A4 P31645 6/20 0.35
CYP2C19 P33261 1/20 0.34
KDM4E B2RXH2 1/20 0.34
CYP3A4 P08684 1/20 0.34
MAPT P10636 1/20 0.34
ALOX15 P16050 1/20 0.34
SLC6A2 P23975 2/20 0.34
SLC6A3 Q01959 2/20 0.34
FFAR1 O14842 1/20 0.34
KCNK2 O95069 1/20 0.34
KCNH2 Q12809 1/20 0.34
CACNA1C Q13936 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3291158 0.95 SLC6A4 (0.39) SRD5A2SLC7A5SLC6A4CYP2C19KDM4E
SCHEMBL8163510 0.94 CYP1A2 (0.42) SRD5A2SLC7A5CYP2C19CYP3A4
SCHEMBL3294031 0.90 NPSR1 (0.41) SRD5A2SLC7A5
SCHEMBL3295214 0.90 SLC6A4 (0.46) SLC6A4SLC6A2SLC6A3
SCHEMBL3299568 0.90 SLC6A4 (0.46) SRD5A2SLC7A5SLC6A4CYP2C19SLC6A2
SCHEMBL3294416 0.90 CA4 (0.46) KDM4ECYP3A4MAPTALOX15
SCHEMBL8625767 0.87 ALDH1A3 (0.50) SRD5A2KDM4EMAPT
SCHEMBL3300767 0.86 SLC7A5 (0.57) SLC7A5SLC6A4CYP2C19KDM4ECYP3A4
SCHEMBL8166263 0.86 PPARG (0.48) SLC7A5SLC6A4SLC6A2SLC6A3FFAR1
SCHEMBL8466535 0.86 SLC7A5 (0.40) SLC7A5SLC6A4CYP2C19KDM4ECYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-5078552-A None JP disclosed
US-7375155-B2 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof HITACHI, LTD. (JP) 2008-05-20 US disclosed
US-7112627-B2 Low dielectric loss tangent films and wiring films HITACHI, LTD. (JP) 2006-09-26 US disclosed
US-20050277753-A1 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof AMOU SATORU 2005-12-15 US disclosed
US-6930140-B2 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof HITACHI, LTD. (JP) 2005-08-16 US disclosed
US-6756441-B2 CROSSLINKING AGENT CONTAINING STYRENE GROUPS, FOR EXAMPLE 1,2-BIS(VINYLPHENYL)ETHANE (BVPE), A FILM FORMING POLYMER, AND A FILLER HITACHI, LTD. (JP) 2004-06-29 US disclosed
US-20040048965-A1 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof AMOU SATORU (JP) 2004-03-11 US disclosed
US-20040038611-A1 Low dielectric loss tangent films and wiring films HITACHI, LTD. (JP) 2004-02-26 US disclosed
US-20020161091-A1 Low dielectric loss tangent resin composition, curable film and cured product, electrical part using the same and method for production thereof HITACHI, LTD. (JP) 2002-10-31 US disclosed
JP-H0578552-A SYNTHETIC RESIN COMPOSITION DAINIPPON INK & CHEM INC 1993-03-30 JP disclosed