SCHEMBL4877289

SCHEMBL4877289

C(=NNc1ccccn1)c1ccco1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPC1 O15118 11/20 0.57
CYP1A2 P05177 2/20 0.57
KDM4E B2RXH2 2/20 0.57
SMN1; SMN2 Q16637 8/20 0.56
RAB9A P51151 11/20 0.54
LMNA P02545 4/20 0.54
GAA P10253 3/20 0.54
L3MBTL1 Q9Y468 2/20 0.54
MAPT P10636 2/20 0.54
MAPK1 P28482 1/20 0.54
CASP3 P42574 1/20 0.54
SENP7 Q9BQF6 1/20 0.54
SENP6 Q9GZR1 1/20 0.54
CYP3A4 P08684 1/20 0.52
POLB P06746 3/20 0.52
ALDH1A1 P00352 1/20 0.52
APEX1 P27695 1/20 0.52
TDP1 Q9NUW8 1/20 0.52
KMT2A Q03164 5/20 0.51
MEN1 O00255 4/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7522459 0.75 RAB9A (0.76) NPC1CYP1A2SMN1; SMN2RAB9ALMNA
SCHEMBL5051613 0.75 PAX8 (0.65) NPC1CYP1A2KDM4ESMN1; SMN2RAB9A
SCHEMBL7522456 0.75 RAB9A (0.76) NPC1CYP1A2SMN1; SMN2RAB9ALMNA
SCHEMBL3066581 0.75 NPC1 (0.62) NPC1KDM4ESMN1; SMN2RAB9ALMNA
SCHEMBL3066579 0.75 NPC1 (0.62) NPC1KDM4ESMN1; SMN2RAB9ALMNA
SCHEMBL29631623 0.75 PAX8 (0.65) NPC1CYP1A2KDM4ESMN1; SMN2RAB9A
SCHEMBL8342118 0.75 PAX8 (0.65) NPC1CYP1A2KDM4ESMN1; SMN2RAB9A
SCHEMBL11304288 0.73 RAB9A (0.69) NPC1CYP1A2KDM4ESMN1; SMN2RAB9A
SCHEMBL11304285 0.73 RAB9A (0.69) NPC1CYP1A2KDM4ESMN1; SMN2RAB9A
SCHEMBL11833203 0.73 RAB9A (0.55) NPC1KDM4ESMN1; SMN2RAB9ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080171440-A1 Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate EBARA CORPORATION (JP) 2008-07-17 US disclosed