SCHEMBL4882728

SCHEMBL4882728

O=C([O-])CC(=O)Cc1ccccc1.O=C([O-])CC(=O)Cc1ccccc1.[Pd+2]

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CES1 P23141 2/20 0.58
CES2 O00748 1/20 0.58
AKR1B1 P15121 1/20 0.52
HDAC8 Q9BY41 2/20 0.50
HDAC6 Q9UBN7 2/20 0.50
MEN1 O00255 1/20 0.50
KMT2A Q03164 1/20 0.50
FNTA P49354 1/20 0.48
FNTB P49356 1/20 0.48
EPHX2 P34913 1/20 0.47
HDAC3 O15379 1/20 0.46
HDAC4 P56524 1/20 0.46
HDAC1 Q13547 1/20 0.46
HDAC7 Q8WUI4 1/20 0.46
HDAC2 Q92769 1/20 0.46
HDAC10 Q969S8 1/20 0.46
HDAC11 Q96DB2 1/20 0.46
HDAC9 Q9UKV0 1/20 0.46
HDAC5 Q9UQL6 1/20 0.46
L3MBTL1 Q9Y468 2/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phenylacetic Acid SCHEMBL27783752 0.84 CES1 (0.71) CES1CES2AKR1B1HDAC8HDAC6
SCHEMBL51367 0.84 CES1 (0.64) CES1CES2AKR1B1HDAC8HDAC6
SCHEMBL6363616 0.82 CES1 (0.61) CES1CES2AKR1B1HDAC8HDAC6
SCHEMBL9111034 0.82 CES1 (0.61) CES1CES2AKR1B1HDAC8HDAC6
SCHEMBL6563606 0.81 CES1 (0.60) CES1CES2AKR1B1HDAC8HDAC6
SCHEMBL3966085 0.80 AKR1B1 (0.65) CES1CES2AKR1B1HDAC8HDAC6
Phenylacetic Acid SCHEMBL6930085 0.80 CES1 (0.71) CES1CES2AKR1B1HDAC8HDAC6
Phenylacetic Acid SCHEMBL62440 0.80 CES1 (0.71) CES1CES2AKR1B1HDAC8HDAC6
Phenylacetic Acid SCHEMBL11248694 0.80 CES1 (0.71) CES1CES2AKR1B1HDAC8HDAC6
Phenylacetic Acid SCHEMBL1685642 0.80 CES1 (0.71) CES1CES2AKR1B1HDAC8HDAC6

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240321803-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2024-09-26 US disclosed
US-20240272551-A1 NEGATIVE-TYPE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE SUMITOMO BAKELITE CO., LTD. (JP) 2024-08-15 US disclosed
CN-116848467-A Photosensitive resin composition, cured film, and semiconductor device 住友电木株式会社 2023-10-03 CN disclosed
WO-2022270527-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE POLMER, CURED FILM AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2022-12-29 WO disclosed
WO-2022270529-A1 NEGATIVE PHOTOSENSITIVE POLYMER, POLYMER SOLUTION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2022-12-29 WO disclosed
WO-2022172988-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND SEMICONDUCTOR DEVICE 住友ベークライト株式会社 2022-08-18 WO disclosed
US-20080125556-A1 Copolymerizing two norbornene monomers, one having a pendant trimethylsilyl or timethylsilylmethyl group, and the other having optional pendant halogen or alkyl groups in the presence of a palladium-based multicomponent catalyst containing palladium, phosphorus, ionic boron and ionic aluminum compounds JSR CORPORATION (JP) 2008-05-29 US disclosed
US-7268196-B2 Process for producing cycloolefin addition polymer JSR CORPORATION (JP) 2007-09-11 US disclosed
US-7241847-B2 Process for producing cycloolefin addition polymer JSR CORPORATION (JP) 2007-07-10 US disclosed
US-20070155922-A1 Process for producing cycloolefin addition polymer JSR CORPORATION (JP) 2007-07-05 US disclosed
US-20070123667-A1 PROCESS FOR PRODUCING CYCLOOLEFIN ADDITION POLYMER JSR CORPORATION (JP) 2007-05-31 US disclosed
EP-1712572-A1 PROCESS FOR PRODUCING CYCLOOLEFIN ADDITION POLYMER JSR Corporation (JP) 2006-10-18 EP disclosed
US-20060217505-A1 Process for producing cycloolefin addition polymer JRS CORPORATION (JP) 2006-09-28 US disclosed
EP-1657259-A1 PROCESS FOR PRODUCING CYCLOOLEFIN ADDITION POLYMER JSR Corporation (JP) 2006-05-17 EP disclosed