SCHEMBL4912937

SCHEMBL4912937

CCCCCCCCCCc1cccc2c1Cc1ccccc1[S+]2[O-]

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LIPG Q9Y5X9 1/20 0.41
KCNH2 Q12809 1/20 0.37
ALDH1A1 P00352 1/20 0.37
CYP1A2 P05177 1/20 0.37
CYP2D6 P10635 1/20 0.37
CYP2C19 P33261 1/20 0.37
CYSLTR2 Q9NS75 6/20 0.36
CYSLTR1 Q9Y271 6/20 0.36
DRD2 P14416 1/20 0.36
SLC6A2 P23975 1/20 0.36
HTR2A P28223 1/20 0.36
HTR2C P28335 1/20 0.36
SLC6A4 P31645 1/20 0.36
BID P55957 3/20 0.36
MCL1 Q07820 3/20 0.36
BCL2L1 Q07817 2/20 0.36
BAK1 Q16611 2/20 0.36
KAT8 Q9H7Z6 2/20 0.36
PPARG P37231 1/20 0.36
PPARA Q07869 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL156108 1.00 LIPG (0.41) LIPGKCNH2ALDH1A1CYP1A2CYP2D6
SCHEMBL2419729 0.94 LIPG (0.33) LIPGALDH1A1CYP1A2CYP2D6CYP2C19
SCHEMBL2401855 0.89 PNMT (0.34) KCNH2CYP2D6CYP2C19DRD2HTR2A
SCHEMBL8500895 0.83 PNMT (0.33)
SCHEMBL166481 0.83 PNMT (0.36)
SCHEMBL2312884 0.80 PNMT (0.34)
SCHEMBL5319446 0.80 PNMT (0.34)
SCHEMBL11049873 0.80 PNMT (0.32)
SCHEMBL11002342 0.77 PNMT (0.36)
SCHEMBL7943734 0.77 PNMT (0.36) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11149171-B2 Thermally-conductive pressure-sensitive adhesive sheet NITTO DENKO CORPORATION (JP) 2021-10-19 US disclosed
US-20160152872-A1 THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2016-06-02 US disclosed
US-20150299531-A1 PRESSURE-SENSITIVE ADHESIVE MATERIAL AND THERMALLY CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2015-10-22 US disclosed
EP-2824156-A1 ADHESIVE RAW MATERIAL AND THERMALLY CONDUCTIVE ADHESIVE SHEET Nitto Denko Corporation (JP) 2015-01-14 EP disclosed
EP-2698406-A1 FLAME-RETARDANT HEAT-CONDUCTIVE ADHESIVE SHEET Nitto Denko Corporation (JP) 2014-02-19 EP disclosed
US-20140037924-A1 FLAME-RETARDANT THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2014-02-06 US disclosed
US-20140004342-A1 FLAME-RETARDANT THERMALLY-CONDUCTIVE PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2014-01-02 US disclosed
EP-2674464-A1 FLAME-RETARDANT THERMALLY-CONDUCTIVE ADHESIVE SHEET Nitto Denko Corporation (JP) 2013-12-18 EP disclosed
WO-2013169702-A1 BASECOAT WITH IMPROVED ADHESION TO BIOPLASTIC PPG INDUSTRIES OHIO, INC. (US) 2013-11-14 WO disclosed
US-20130244020-A1 BUBBLE-CONTAINING THERMALLY CONDUCTIVE RESIN COMPOSITION LAYER, PRODUCING METHOD THEREOF, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING BUBBLE-CONTAINING THERMALLY CONDUCTIVE RESIN COMPOSITION LAYER NITTO DENKO CORPORATION (JP) 2013-09-19 US disclosed
EP-2639259-A1 BUBBLE-CONTAINING THERMALLY-CONDUCTIVE RESIN-COMPOSITION LAYER, MANUFACTURING METHOD THEREFOR, AND PRESSURE-SENSITIVE ADHESIVE SHEET USING SAID RESIN-COMPOSITION LAYER Nitto Denko Corporation (JP) 2013-09-18 EP disclosed
US-20080271842-A1 Methods of Reducing Surface Checking on Wood Compositions CHEMCRAFT INTERNATIONAL, INC. (US) 2008-11-06 US disclosed
WO-2006081346-A2 METHODS OF REDUCING SURFACE CHECKING ON WOOD COMPOSITIONS CHEMCRAFT INTERNATIONAL, INC. (US) 2006-08-03 WO disclosed