SCHEMBL4940251

SCHEMBL4940251

O=C(c1ccc(NC2CCCCC2)cc1)c1ccc(NC2CCCCC2)cc1

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 3/20 0.51
POLB P06746 2/20 0.51
MAPT P10636 2/20 0.51
GAA P10253 1/20 0.51
TRPV1 Q8NER1 1/20 0.49
NPC1 O15118 5/20 0.49
RAB9A P51151 4/20 0.49
EPHX1 P07099 2/20 0.49
KMT2A Q03164 3/20 0.48
MEN1 O00255 2/20 0.48
HCAR3 P49019 1/20 0.47
SRD5A2 P31213 1/20 0.47
SMN1; SMN2 Q16637 5/20 0.46
ALDH1A1 P00352 4/20 0.46
EPHX2 P34913 1/20 0.46
CYP1A2 P05177 1/20 0.46
HPGD P15428 1/20 0.46
CYP2C19 P33261 1/20 0.46
HDAC8 Q9BY41 1/20 0.45
MAPK1 P28482 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7584196 0.94 HCAR3 (0.49) LMNAPOLBMAPTGAATRPV1
SCHEMBL7937040 0.93 ALDH1A1 (0.55) LMNAPOLBMAPTGAATRPV1
SCHEMBL11465510 0.87 HCAR3 (0.58) LMNAPOLBMAPTGAATRPV1
SCHEMBL11460577 0.87 HCAR3 (0.58) LMNAPOLBMAPTGAATRPV1
SCHEMBL3476595 0.87 HCAR3 (0.58) LMNAPOLBMAPTGAATRPV1
SCHEMBL11478987 0.87 HCAR3 (0.58) LMNAPOLBMAPTGAATRPV1
SCHEMBL11461585 0.87 HCAR3 (0.58) LMNAPOLBMAPTGAATRPV1
SCHEMBL10425208 0.85 SYK (0.51) LMNAPOLBMAPTGAATRPV1
SCHEMBL11400282 0.85 NPC1 (0.67) LMNAPOLBMAPTGAANPC1
SCHEMBL792600 0.85 NPC1 (0.67) LMNAPOLBMAPTGAANPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080118867-A1 Pattern Forming Material, Pattern Forming Apparatus, And Pattern Forming Process ASAHI KASEI E-MATERIALS CORPORATION (JP) 2008-05-22 US disclosed
US-20080113302-A1 Pattern Forming Process FUJIFILM CORPORATION (JP) 2008-05-15 US disclosed
WO-2005109098-A1 PATTERN FORMING MATERIAL, PATTERN FORMING APPARATUS, AND PATTERN FORMING PROCESS FUJI PHOTO FILM CO., LTD. (JP) 2005-11-17 WO disclosed
WO-2005093515-A1 PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE FILM, AND PERMANENT PATTERN AND PROCESS FOR FORMING THE SAME FUJI PHOTO FILM CO., LTD. (JP) 2005-10-06 WO disclosed
WO-2005093793-A1 PROCESS FOR FORMING PERMANENT PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2005-10-06 WO disclosed
WO-2005091078-A1 PATTERN FORMING PROCESS AND PATTERN FUJI PHOTO FILM CO., LTD. (JP) 2005-09-29 WO disclosed
WO-2005083522-A1 PATTERN FORMING PROCESS FUJI PHOTO FILM CO., LTD. (JP) 2005-09-09 WO disclosed