Ethylene Glycol

Ethylene Glycol

SCHEMBL4948878

CCCCO[Si](OCCCC)(OCCCC)OCCCC.OCCO

nearest known ligand 0.50

Full drug profile on Sugi Atlas →

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.50
ALDH1A1 P00352 3/20 0.43
SMN1; SMN2 Q16637 2/20 0.41
MEN1 O00255 2/20 0.39
KMT2A Q03164 2/20 0.39
THRB P10828 1/20 0.39
HTT P42858 1/20 0.39
MAPT P10636 1/20 0.39
LMNA P02545 2/20 0.39
HSD17B10 Q99714 1/20 0.39
ADRB2 P07550 1/20 0.38
ADRB1 P08588 1/20 0.38
ADRB3 P13945 1/20 0.38
ATM Q13315 1/20 0.34
ACHE P22303 1/20 0.33
CYP3A4 P08684 1/20 0.33
HPGD P15428 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49555 0.89 ADRB2 (0.45) TSHRALDH1A1SMN1; SMN2THRBLMNA
SCHEMBL27877693 0.86 TSHR (0.40) TSHRALDH1A1SMN1; SMN2MEN1KMT2A
SCHEMBL29053698 0.86 ADRB2 (0.43) TSHRALDH1A1SMN1; SMN2THRBLMNA
SCHEMBL1607987 0.83 ADRB2 (0.41) TSHRMEN1KMT2ATHRBHTT
SCHEMBL17644804 0.83 ADRB2 (0.41) TSHRALDH1A1SMN1; SMN2THRBLMNA
SCHEMBL17644810 0.83 ADRB2 (0.41) TSHRMEN1KMT2ATHRBHTT
SCHEMBL1608048 0.83 ADRB2 (0.41) TSHRALDH1A1SMN1; SMN2THRBLMNA
SCHEMBL17644807 0.83 ADRB2 (0.41) TSHRMEN1KMT2ATHRBHTT
SCHEMBL17644809 0.83 ADRB2 (0.41) TSHRALDH1A1SMN1; SMN2THRBLMNA
SCHEMBL4328341 0.83 ADRB2 (0.41) TSHRALDH1A1SMN1; SMN2THRBLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080283972-A1 Silicon Compounds for Producing Sio2-Containing Insulating Layers on Chips DEGUSSA AG (DE) 2008-11-20 US claimed
EP-1716269-A2 PROCESS FOR PRODUCING SIO2-CONTAINING INSULATING LAYERS ON CHIPS Degussa GmbH (DE) 2006-11-02 EP claimed
WO-2005080629-A2 SILICON COMPOUNDS FOR PRODUCING SiO2-CONTAINING INSULATING LAYERS ON CHIPS DEGUSSA AG (DE) 2005-09-01 WO claimed
US-20080283972-A1 Silicon Compounds for Producing Sio2-Containing Insulating Layers on Chips DEGUSSA AG (DE) 2008-11-20 US disclosed
EP-1716269-A2 PROCESS FOR PRODUCING SIO2-CONTAINING INSULATING LAYERS ON CHIPS Degussa GmbH (DE) 2006-11-02 EP disclosed
WO-2005080629-A2 SILICON COMPOUNDS FOR PRODUCING SiO2-CONTAINING INSULATING LAYERS ON CHIPS DEGUSSA AG (DE) 2005-09-01 WO disclosed