SCHEMBL4953473

SCHEMBL4953473

Nc1ccc(Cc2ccc(N)c(S(N)(=O)=O)c2)cc1

nearest known ligand 0.54

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA1 P00915 10/20 0.54
CA2 P00918 10/20 0.54
CA9 Q16790 10/20 0.54
CA12 O43570 8/20 0.54
CA14 Q9ULX7 7/20 0.54
ALDH1A1 P00352 4/20 0.50
CYP3A4 P08684 3/20 0.50
TSHR P16473 2/20 0.50
TDP1 Q9NUW8 2/20 0.50
KDM4E B2RXH2 1/20 0.46
MEN1 O00255 1/20 0.46
POLB P06746 1/20 0.46
GAA P10253 1/20 0.46
MAPT P10636 1/20 0.46
RAB9A P51151 1/20 0.46
KMT2A Q03164 1/20 0.46
CA7 P43166 6/20 0.42
CA6 P23280 5/20 0.42
CA5A P35218 5/20 0.42
CA5B Q9Y2D0 5/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4955790 0.86 CA2 (0.54) CA1CA2CA9CA12CA14
SCHEMBL4956588 0.85 CA1 (0.61) CA1CA2CA9CA12CA14
SCHEMBL31095544 0.78 CA2 (0.54) CA1CA2CA9CA12CA14
SCHEMBL393315 0.78 CA2 (0.54) CA1CA2CA9CA12CA14
SCHEMBL4516488 0.78 CA2 (0.52) CA1CA2CA9CA12CA14
SCHEMBL8400669 0.76 GAA (0.50) CA1CA2CA9ALDH1A1CYP3A4
SCHEMBL11122407 0.76 CA2 (0.55) CA1CA2CA9CA12CA14
SCHEMBL349528 0.74 ALDH1A1 (0.67) CA1CA2CA9CA12CA14
Ammonia Solution, Strong SCHEMBL7547968 0.74 GAA (0.48) CA1CA2CA9ALDH1A1CYP3A4
SCHEMBL28459647 0.74 CA1 (0.53) CA1CA2CA9CA12CA14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7373064-B2 Polymeric optical waveguide film HITACHI CHEMICAL CO., LTD. (JP) 2008-05-13 US disclosed
US-7162134-B2 Polymeric optical waveguide film HITACHI CHEMICAL CO., LTD. (JP) 2007-01-09 US disclosed
US-20060291790-A1 POLYMERIC OPTICAL WAVEGUIDE FILM HITACHI CHEMICAL CO., LTD. (JP) 2006-12-28 US disclosed
US-7139460-B2 Optical element, method of producing optical elements, coating device, and coating method HITACHI CHEMICAL COMPANY, LTD. (JP) 2006-11-21 US disclosed
US-20060251379-A1 Optical element, process for producing optical element, coating equipment, and coating method KURODA TOSHIHIRO 2006-11-09 US disclosed
US-20050002631-A1 Polymeric optical waveguide film HITACHI CHEMICAL CO., LTD. (JP) 2005-01-06 US disclosed
US-20040234222-A1 Optical element, method of producing optical elements, coating device, and coating method HITACHI CHEMICAL COMPANY, LTD. (JP) 2004-11-25 US disclosed
US-6810181-B2 LAYER OF A FLUORINE-CONTAINING POLYIMIDE AND A LAYER OF A FLUORINE-FREE RESIN IS INTERPOSED BETWEEN THE POLYIMIDE LAYER AND THE ELECTRODE HITACHI CHEMICAL CO., LTD. (JP) 2004-10-26 US disclosed
US-20040096161-A1 Electrode structure HITACHI CHEMICAL CO., LTD. (JP) 2004-05-20 US disclosed
US-20030054184-A1 Optical element, method for the production thereof and optical module HITACHI CHEMICAL CO., LTD. (JP) 2003-03-20 US disclosed
EP-0373952-A2 Photosensitive resin composition and photosensitive element using the same Hitachi Chemical Co., Ltd. (JP) 1990-06-20 EP disclosed
US-4847358-A HEAT RESISTANT ELECTRONICS HITACHI CHEMICAL COMPANY, LTD. (JP) 1989-07-11 US disclosed
EP-0311374-A2 Dicylcohexyl-3,4,3'4'-tetra-carboxylic acid or dianhydride thereof and polyamide-acid and polymide obtained therefrom Hitachi Chemical Co., Ltd. (JP) 1989-04-12 EP disclosed
EP-0308270-A2 Processes for preparation of polyimide-isoindoquinazoline dione and precursor thereof Hitachi Chemical Co., Ltd. (JP) 1989-03-22 EP disclosed
US-4758476-A Polyimide precursor resin composition and semiconductor device using the same HITACHI CHEMICAL COMPANY, LTD. (JP) 1988-07-19 US disclosed
US-4650849-A Photosensitive curable resin composition SHIN-ETSU CHEMICAL CO., LTD. (JP) 1987-03-17 US disclosed
EP-0184937-A2 Polyimide precursor resin composition and semiconductor device using the same Hitachi Chemical Co., Ltd. (JP) 1986-06-18 EP disclosed
US-4497922-A Compositions of materials for forming protective film in semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 1985-02-05 US disclosed
US-4338426-A Intermediate, copolymer resin and production thereof HITACHI CHEMICAL COMPANY, LTD. (JP) 1982-07-06 US disclosed
US-4225702-A Method of preparing polyamide acid type intermediates for processing of semiconductors HITACHI CHEMICAL COMPANY, LTD. (JP) 1980-09-30 US disclosed