⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL706899 | 0.78 | — | — | |
| SCHEMBL702887 | 0.74 | — | — | |
| SCHEMBL1471084 | 0.72 | ALDH1A1 (0.43) | — | |
| SCHEMBL2363426 | 0.71 | ALDH1A1 (0.37) | — | |
| SCHEMBL2353936 | 0.71 | ALDH1A1 (0.41) | — | |
| SCHEMBL1408892 | 0.71 | ALDH1A1 (0.41) | — | |
| Butane SCHEMBL6454649 | 0.71 | ALDH1A1 (0.41) | — | |
| SCHEMBL28056394 | 0.69 | — | — | |
| SCHEMBL9298975 | 0.69 | CYP4F2 (0.34) | — | |
| SCHEMBL496528 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117487507-A | Mildew-proof sealing silicone adhesive and preparation method thereof | 佛山市元通胶粘实业有限公司 | 2024-02-02 | — | — | CN | claimed |
| CN-112280525-B | Single-component high-temperature-resistant water-immersion silicone adhesive and preparation method and application thereof | 江西蓝星星火有机硅有限公司 | 2022-08-30 | — | — | CN | claimed |
| CN-112280525-A | Single-component high-temperature-resistant water-immersion silicone adhesive and preparation method and application thereof | 江西蓝星星火有机硅有限公司 | 2021-01-29 | — | — | CN | claimed |
| EP-0852992-B1 | Conservation of organic and inorganic materials | DOW CORNING (US) | 2004-04-21 | — | — | EP | claimed |
| US-6022589-A | IMPREGNATING ORGANIC AND INORGANIC MATERIALS WITH SILOXANES AND SILANES AND ULTIMATELY CURING SUCH MATERIALS TO PROVIDE PRESERVATION PROPERTIES TO SUCH MATERIALS; USE IN PRESERVATION AND CONSERVATION OF ANCIENT ARTIFACTS | DOW CORNING CORPORATION (US) | 2000-02-08 | — | — | US | claimed |
| EP-0852992-A2 | Conservation of organic and inorganic materials | DOW CORNING CORPORATION (US) | 1998-07-15 | — | — | EP | claimed |
| CN-117487507-A | Mildew-proof sealing silicone adhesive and preparation method thereof | 佛山市元通胶粘实业有限公司 | 2024-02-02 | — | — | CN | disclosed |
| CN-112280525-B | Single-component high-temperature-resistant water-immersion silicone adhesive and preparation method and application thereof | 江西蓝星星火有机硅有限公司 | 2022-08-30 | — | — | CN | disclosed |
| CN-112280525-A | Single-component high-temperature-resistant water-immersion silicone adhesive and preparation method and application thereof | 江西蓝星星火有机硅有限公司 | 2021-01-29 | — | — | CN | disclosed |
| WO-2020108734-A1 | COMPOSITE PARTICLES WITH ORGANIC AND INORGANIC DOMAINS | WACKER CHEMIE AG (DE) | 2020-06-04 | — | — | WO | disclosed |
| CN-101124233-B | Novel curable resin, method for producing same, epoxy resin composition and electronic component device | HITACHI CHEMICAL CO LTD | 2012-12-05 | — | — | CN | disclosed |
| US-8129467-B2 | Curing accelerating compound-silica composite material, method for producing curing accelerating compound-silica composite material, curing accelerator, curable resin composition, and electronic component device | HITACHI CHEMICAL CO., LTD. (JP) | 2012-03-06 | — | — | US | disclosed |
| US-8124239-B2 | Silica film forming material, silica film and method of manufacturing the same, multilayer wiring structure and method of manufacturing the same, and semiconductor device and method of manufacturing the same | FUJITSU LIMITED (JP) | 2012-02-28 | — | — | US | disclosed |
| EP-0852992-B1 | Conservation of organic and inorganic materials | DOW CORNING (US) | 2004-04-21 | — | — | EP | disclosed |
| CN-1105030-C | Thermal waterless lithographic printing plate | KODAK POLYCHROME GRAPHICS CO (US) | 2003-04-09 | — | — | CN | disclosed |
| CN-1269752-A | Thermal waterless lithographic printing plate | KODAK POLYCHROME GRAPHICS CO (US) | 2000-10-11 | — | — | CN | disclosed |
| EP-0852992-A2 | Conservation of organic and inorganic materials | DOW CORNING CORPORATION (US) | 1998-07-15 | — | — | EP | disclosed |
| US-5580619-A | LIQUID CRYSTAL DISPLAY | NIPPON SHOKUBAI CO., LTD. (JP) | 1996-12-03 | — | — | US | disclosed |
| US-5088576-A | Using gel which is blend of plastic and plasticizer | E.A.P. AKUSTIK GMBH (DE) | 1992-02-18 | — | — | US | disclosed |
| US-4588770-A | CONTAIN MODIFIED POLYESTERS AND FILLERS | BAYER AKTIENGESELLSCHAFT (DE) | 1986-05-13 | — | — | US | disclosed |