Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TRPA1 | O75762 | 1/20 | 0.40 |
| ▸ | TGFBR1 | P36897 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methacrylic Acid SCHEMBL4158756 | 0.91 | TGFBR1 (0.41) | TRPA1TGFBR1ALDH1A1 | |
| Methacrylic Acid SCHEMBL514764 | 0.91 | TGFBR1 (0.41) | TRPA1TGFBR1ALDH1A1 | |
| Methacrylic Acid SCHEMBL1480102 | 0.91 | TGFBR1 (0.41) | TRPA1TGFBR1ALDH1A1 | |
| Methacrylic Acid SCHEMBL3974705 | 0.91 | TGFBR1 (0.41) | TRPA1TGFBR1ALDH1A1 | |
| Methacrylic Acid SCHEMBL9815885 | 0.84 | TGFBR1 (0.45) | TGFBR1ALDH1A1 | |
| Methacrylic Acid SCHEMBL472593 | 0.84 | TGFBR1 (0.45) | TGFBR1ALDH1A1 | |
| Methacrylic Acid SCHEMBL147269 | 0.84 | TGFBR1 (0.45) | TGFBR1ALDH1A1 | |
| Methacrylic Acid SCHEMBL5595699 | 0.84 | TGFBR1 (0.45) | TGFBR1ALDH1A1 | |
| Methacrylic Acid SCHEMBL14718311 | 0.80 | ALDH1A1 (0.67) | ALDH1A1 | |
| Methacrylic Acid SCHEMBL8956036 | 0.78 | CHRM1 (0.39) | TGFBR1ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 87 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250155808-A1 | RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN | ZEON CORPORATION (JP) | 2025-05-15 | — | — | US | disclosed |
| WO-2024143072-A1 | COMPOSITION AND CURED PRODUCT | 株式会社ADEKA | 2024-07-04 | — | — | WO | disclosed |
| WO-2024070672-A1 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | 日本ゼオン株式会社 | 2024-04-04 | — | — | WO | disclosed |
| CN-116997856-A | Method for manufacturing flexible printed board | 株式会社钟化 | 2023-11-03 | — | — | CN | disclosed |
| CN-115918275-B | Method for manufacturing flexible printed board | 株式会社钟化 | 2023-10-27 | — | — | CN | disclosed |
| WO-2023189969-A1 | RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN | 日本ゼオン株式会社 | 2023-10-05 | — | — | WO | disclosed |
| EP-3932906-B1 | NOVEL COMPOUND, COMPOSITION CONTAINING SAID COMPOUND, AND CURED OBJECT | ADEKA CORP (JP) | 2023-07-12 | — | — | EP | disclosed |
| US-11667609-B2 | Compound, composition containing said compound, self-healing material, surface coating agent, paint, adhesive, material for battery and cured product | ADEKA CORPORATION (JP) | 2023-06-06 | — | — | US | disclosed |
| CN-113544120-B | Novel compound, composition containing same, self-repairing material, surface coating agent, paint, adhesive, battery material, and cured product | 株式会社ADEKA | 2023-05-02 | — | — | CN | disclosed |
| CN-115918275-A | Method for manufacturing flexible printed board | 株式会社钟化 | 2023-04-04 | — | — | CN | disclosed |
| US-20090181324-A1 | PHOTOSENSITIVE POLYIMIDES | ETERNAL CHEMICAL CO., LTD. | 2009-07-16 | — | — | US | disclosed |
| US-20070178313-A1 | Aqueous primer composition, method of surface treating by using the same and laminated structure thereof | DAINIPPON INK AND CHEMICALS, INC. (JP) | 2007-08-02 | — | — | US | disclosed |
| EP-1788050-A1 | AQUEOUS PRIMER COMPOSITION, SURFACE TREATING METHOD USING SAME, AND MULTILAYER STRUCTURE | Dainippon Ink and Chemicals, Incorporated (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20060199920-A1 | Photosensitive resin composition capable of being developed with aqueous developer and photosensitive dry film resist, and use thereof | KANEKA CORPORATION (JP) | 2006-09-07 | — | — | US | disclosed |
| US-20060142542-A1 | Phosphazene compound, photosensitive resin composition and use thereof | KANEKA CORPORATION (JP) | 2006-06-29 | — | — | US | disclosed |
| US-20040235992-A1 | Photosensitive resin composition and photosensitive dry film resist and photosensitive coverlay film produced therefrom | KANEKA CORPORATION (JP) | 2004-11-25 | — | — | US | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| EP-0909752-B1 | DI(METH)ACRYLATES | KYOWA YUKA KK (JP) | 2001-09-05 | — | — | EP | disclosed |
| EP-0909752-A1 | DI(METH)ACRYLATES | Kyowa Yuka Co., Ltd. (JP) | 1999-04-21 | — | — | EP | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-11667609-B2 | Compound, composition containing said compound, self-healing material, surface coating agent, paint, adhesive, material for battery and cured product | H1-0, H1-10, RAD51 | TRPA1 461/4885TGFBR1 2143/4885ALDH1A1 323/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.