Predicted protein targets (top 19)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.48 |
| ▸ | L3MBTL1 | Q9Y468 | 3/20 | 0.47 |
| ▸ | MAPT | P10636 | 1/20 | 0.47 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.47 |
| ▸ | GLA | P06280 | 1/20 | 0.47 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.45 |
| ▸ | CA12 | O43570 | 2/20 | 0.45 |
| ▸ | CA1 | P00915 | 2/20 | 0.45 |
| ▸ | CA2 | P00918 | 2/20 | 0.45 |
| ▸ | CA9 | Q16790 | 2/20 | 0.45 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.45 |
| ▸ | PTGES2 | Q9H7Z7 | 1/20 | 0.43 |
| ▸ | PTPRC | P08575 | 1/20 | 0.42 |
| ▸ | GAA | P10253 | 1/20 | 0.42 |
| ▸ | HCRTR1 | O43613 | 1/20 | 0.42 |
| ▸ | HTT | P42858 | 2/20 | 0.42 |
| ▸ | MCOLN3 | Q8TDD5 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7108847 | 0.86 | ALDH1A1 (0.50) | ALDH1A1L3MBTL1MAPTNPSR1GLA | |
| SCHEMBL498544 | 0.85 | MEN1 (0.43) | ALDH1A1L3MBTL1MAPTNPSR1CA12 | |
| SCHEMBL12125057 | 0.84 | ALDH1A1 (0.48) | ALDH1A1L3MBTL1MAPTNPSR1GLA | |
| SCHEMBL9114761 | 0.84 | ALDH1A1 (0.48) | ALDH1A1L3MBTL1MAPTNPSR1GLA | |
| SCHEMBL1896177 | 0.83 | CYP1A2 (0.53) | ALDH1A1L3MBTL1MAPTNPSR1CA12 | |
| SCHEMBL8726763 | 0.82 | TRPV4 (0.55) | ALDH1A1L3MBTL1MAPTNPSR1GLA | |
| SCHEMBL6722281 | 0.82 | ALDH1A1 (0.47) | ALDH1A1L3MBTL1MAPTNPSR1GLA | |
| SCHEMBL31511099 | 0.82 | TRPV4 (0.55) | ALDH1A1L3MBTL1MAPTNPSR1GLA | |
| SCHEMBL419398 | 0.82 | HSD17B10 (0.54) | ALDH1A1L3MBTL1MAPTNPSR1GLA | |
| SCHEMBL29469832 | 0.82 | CA1 (0.60) | ALDH1A1L3MBTL1MAPTNPSR1GLA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111694215-B | Photoresist composition and method for forming photolithographic pattern | 常州强力先端电子材料有限公司 | 2022-04-19 | — | — | CN | disclosed |
| CN-111694215-A | Photoresist composition and method for forming photolithographic pattern | 常州强力先端电子材料有限公司 | 2020-09-22 | — | — | CN | disclosed |
| US-8105763-B2 | Method of forming plated product using negative photoresist composition and photosensitive composition used therein | TOKYO OHKA KOGYO CO., LTD. (JP) | 2012-01-31 | — | — | US | disclosed |
| US-7879525-B2 | A photoresist comprising a resin that undergoes a change in alkali solubility by an acid, an acid generating compound and a corrosion inhibitor, e.g. trimercapto-1,3,5-triazine; stabiliity prior to development; used in the manufacturing of connection terminals during the mounting of semiconductors | TOKYO OHKA KOGYO CO., LTD. (JP) | 2011-02-01 | — | — | US | disclosed |
| EP-2202579-A2 | Chemically amplified photoresist composition, photoresist laminated product, manufacturing method for photoresist composition, manufacturing method for photoresist pattern, and manufacturing method for connection element | Tokyo Ohka Kogyo Co., Ltd. (JP) | 2010-06-30 | — | — | EP | disclosed |
| US-20080032242-A1 | Method of Forming Plated Product Using Negative Photoresist Composition and Photosensitive Composition Used Therein | TOKYO OHKA KOGYO CO., LTD. (JP) | 2008-02-07 | — | — | US | disclosed |
| US-20070275320-A1 | Chemically Amplified Photorestist Composition, Laminated Product, and Connection Element | HITACHI CONSTRUCTION MACHINERY CO., LTD. (JP) | 2007-11-29 | — | — | US | disclosed |
| EP-1818722-A1 | CHEMICAL AMPLIFICATION PHOTORESIST COMPOSITION, PHOTORESIST LAYER LAMINATE, METHOD FOR PRODUCING PHOTORESIST COMPOSITION, METHOD FOR PRODUCING PHOTORESIST PATTERN AND METHOD FOR PRODUCING CONNECTING TERMINAL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-08-15 | — | — | EP | disclosed |
| EP-1761823-A1 | METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2007-03-14 | — | — | EP | disclosed |
| WO-2006003757-A1 | METHOD OF FORMING PLATED PRODUCT USING NEGATIVE PHOTORESIST COMPOSITION AND PHOTOSENSITIVE COMPOSITION USED THEREIN | TOKYO OHKA KOGYO CO., LTD. (JP) | 2006-01-12 | — | — | WO | disclosed |
| US-6838229-B2 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. (JP) | 2005-01-04 | — | — | US | disclosed |
| EP-1329160-A2 | 4-ACYLAMINOPYRAZOLE DERIVATIVES | Sankyo Company, Limited (JP) | 2003-07-23 | — | — | EP | disclosed |
| US-20030039921-A1 | Chemically amplified negative photoresist composition for the formation of thick films, photoresist base material and method of forming bumps using the same | TOKYO OHKA KOGYO CO., LTD. | 2003-02-27 | — | — | US | disclosed |
| US-5955241-A | Chemical-amplification-type negative resist composition and method for forming negative resist pattern | TOKYO OHKA KOGYO CO., LTD. (JP) | 1999-09-21 | — | — | US | disclosed |