SCHEMBL499362

SCHEMBL499362

CC(O)(C(=O)c1ccccc1)c1ccccc1.Cc1ccc(S(=O)(=O)O)cc1

nearest known ligand 0.46

Known targets — ChEMBL curated mechanism

ABL1BMXBRAFBTKCHRNA4CHRNB2CSNK1EEGFRERBB2F10FLT1FLT3FLT4IGF1RINSRITKJAK3KDRKITOPRM1PARP1PARP2PDGFRBPIK3CDRAF1RETSLC18A2TECTXKdacAdacBdacCftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RECQL P46063 1/20 0.46
CYP2D6 P10635 1/20 0.43
MAPK1 P28482 1/20 0.43
ALDH1A1 P00352 6/20 0.43
TDP1 Q9NUW8 2/20 0.43
TP53 P04637 1/20 0.43
SMN1; SMN2 Q16637 3/20 0.42
TSHR P16473 1/20 0.42
CES1 P23141 2/20 0.41
CES2 O00748 1/20 0.41
LMNA P02545 4/20 0.40
KDM4E B2RXH2 1/20 0.40
MAPT P10636 1/20 0.40
HTT P42858 1/20 0.40
L3MBTL1 Q9Y468 1/20 0.40
MEN1 O00255 2/20 0.40
KMT2A Q03164 2/20 0.40
NOD2 Q9HC29 1/20 0.39
HSD11B1 P28845 1/20 0.39
PTGS2 P35354 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL504244 0.83 RECQL (0.47) RECQLCYP2D6MAPK1ALDH1A1TDP1
SCHEMBL58021 0.81 CES1 (0.55) CYP2D6ALDH1A1TDP1TSHRCES1
Benzil SCHEMBL2093919 0.78 CES2 (0.68) RECQLCYP2D6MAPK1ALDH1A1TDP1
Benzoic Acid SCHEMBL9261231 0.78 SMN1; SMN2 (0.57) RECQLCYP2D6MAPK1ALDH1A1TDP1
SCHEMBL28690553 0.77 SMN1; SMN2 (0.48) RECQLCYP2D6MAPK1ALDH1A1TDP1
Benzophenone SCHEMBL19358627 0.77 AKR1C3 (0.43) RECQLCYP2D6MAPK1ALDH1A1TDP1
Acetophenone SCHEMBL9253880 0.77 RECQL (0.54) RECQLCYP2D6MAPK1ALDH1A1TDP1
Benzoic Acid SCHEMBL7747508 0.77 SMN1; SMN2 (0.55) RECQLCYP2D6MAPK1ALDH1A1TDP1
Methoxymethane SCHEMBL7788767 0.76 CES1 (0.59) CYP2D6ALDH1A1TDP1TSHRCES1
SCHEMBL11661275 0.76 CES1 (0.50) CYP2D6ALDH1A1TDP1TSHRCES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 227 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11909031-B2 Film electrode, resin layer forming ink, inorganic layer forming ink, and electrode printing apparatus RICOH COMPANY, LTD. (JP) 2024-02-20 US disclosed
US-20240053680-A1 PHOTOSENSITIVE DRY FILM, LAMINATED FILM, METHOD FOR PRODUCING LAMINATED FILM, AND METHOD FOR PRODUCING PATTERNED RESIST FILM TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-15 US disclosed
US-11803122-B2 Chemical amplification-type photosensitive composition, photosensitive dry film, production method of patterned resist layer, production method of plated molded article, compound, and production method of compound TOKYO OHKA KOGYO CO., LTD. (JP) 2023-10-31 US disclosed
CN-109557764-B Chemically amplified positive photosensitive resin composition, resist pattern, method for forming the same, and electronic device 奇美实业股份有限公司 2023-09-12 CN disclosed
US-11754926-B2 Method of forming resist pattern, resist composition and method of producing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2023-09-12 US disclosed
WO-2023162552-A1 CHEMICALLY AMPLIFIED POSITIVE PHOTOSENSITIVE COMPOSITION, PRODUCTION METHOD FOR SUBSTRATE WITH TEMPLATE, AND PRODUCTION METHOD FOR PLATED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
US-20230273521-A1 CHEMICALLY AMPLIFIED PHOTOSENTIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-31 US disclosed
WO-2023162551-A1 METHOD FOR PRODUCING PLATED SHAPED ARTICLE 東京応化工業株式会社 2023-08-31 WO disclosed
US-20230229084-A1 CHEMICALLY AMPLIFIED PHOTOSENSITIVE COMPOSITION, PHOTOSENSITIVE DRY FILM, PRODUCTION METHOD OF SUBSTRATE HAVING TEMPLATE FOR PLATING, AND PRODUCTION METHOD OF PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2023-07-20 US disclosed
EP-3702387-B1 PHOTOSENSITIVE RESIN COMPOSITION, AND METHOD FOR ETCHING GLASS SUBSTRATE TOKYO OHKA KOGYO CO LTD (JP) 2023-05-10 EP disclosed
US-6225476-B1 ACRYLIC ESTER COMPOUND HAVING ALKOXYCARBONYL GROUP OR GROUP DERIVED FROM MOLECULE OF LACTONE COMPOUND BY REMOVING HYDROGEN ATOM BONDED TO CARBON ATOM; MONOMER OF FILM-FORMING RESIN TOKYO OHKA KOGYO CO., LTD. (JP) 2001-05-01 US disclosed
US-6087063-A Positive-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2000-07-11 US disclosed
US-6077644-A Positive-working resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 2000-06-20 US disclosed
US-6071670-A PHOTORESIST RESIN COMPRISING PHOTOACID GENERATING COMPOUND AND AN ACID HYDROLYZABLE OLIGOMER HAVING ALICYCLIC OR POLYCONDENSED AROMATIC BACKBONE; ALKALI DEVELOPMENT WITH HIGH RESOLUTION, DRY ETCH RESISTANCE KABUSHIKI KAISHA TOSHIBA (JP) 2000-06-06 US disclosed
US-6042988-A ALKALI-SOLUBLE RESIN, A COMPOUND CAPABLE OF GENERATING AN ACID BY IRRADIATION AND A CROSSLINKING AGENT, AND FURTHER CONTAINS AN ORGANIC CARBOXYLIC ACID AS ACIDIC COMPOUND AND ORGANIC AMINE AS ALKALINE COMPOUND; DEFINITION AND PRECISION TOKYO OHKA KOGYO CO., LTD. (JP) 2000-03-28 US disclosed
US-5932391-A CONTAINING AN ACYCLIC COMPOUND WHICH IS A VINYL POLYMERBEING LIGHT ABSORBENT KABUSHIKI KAISHA TOSHIBA (JP) 1999-08-03 US disclosed
US-5929271-A Compounds for use in a positive-working resist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1999-07-27 US disclosed
US-5817444-A POLYHYDROXYSTYRENE SUBSTITUTED WITH TETRAHYDROPYRAN GROUPS, POLYHYDROXYSTYRENE SUBSTITUTED WITH ALKOXYALKYL GROUPS TOKYO OHKA KOGYO CO., LTD. (JP) 1998-10-06 US disclosed
US-5789136-A Negative-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1998-08-04 US disclosed
US-5700625-A Negative-working photoresist composition TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-23 US disclosed