SCHEMBL5013944

SCHEMBL5013944

CCCCCCCCCCCCCCCCCC(CCCCCCCCCCCC)OC(N)=O

nearest known ligand 0.45

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 7/20 0.45
FFAR1 O14842 1/20 0.45
MAPT P10636 2/20 0.44
ZDHHC7 Q9NXF8 1/20 0.44
MAPK1 P28482 1/20 0.44
LCK P06239 1/20 0.44
PPARD Q03181 1/20 0.44
ZDHHC20 Q5W0Z9 1/20 0.44
ZDHHC2 Q9UIJ5 1/20 0.44
LMNA P02545 3/20 0.42
LAP3 P28838 1/20 0.42
CA2 P00918 1/20 0.42
FAAH O00519 1/20 0.42
GRIK1 P39086 1/20 0.42
GRIK2 Q13002 1/20 0.42
ALDH1A1 P00352 1/20 0.42
SMPD1 P17405 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22005296 1.00 GPR84 (0.45) GPR84FFAR1MAPTZDHHC7MAPK1
SCHEMBL2436142 1.00 GPR84 (0.45) GPR84FFAR1MAPTZDHHC7MAPK1
SCHEMBL27891806 1.00 GPR84 (0.45) GPR84FFAR1MAPTZDHHC7MAPK1
SCHEMBL20459198 1.00 GPR84 (0.45) GPR84FFAR1MAPTZDHHC7MAPK1
SCHEMBL21300541 1.00 GPR84 (0.45) GPR84FFAR1MAPTZDHHC7MAPK1
SCHEMBL5012509 1.00 GPR84 (0.45) GPR84FFAR1MAPTZDHHC7MAPK1
SCHEMBL5953699 0.98 CA2 (0.46) GPR84FFAR1MAPTZDHHC7MAPK1
SCHEMBL4856594 0.98 CA2 (0.46) GPR84FFAR1MAPTZDHHC7MAPK1
SCHEMBL10844707 0.98 GPR84 (0.42) GPR84FFAR1MAPTZDHHC7MAPK1
SCHEMBL20835181 0.96 CTSK (0.42) GPR84FFAR1MAPTZDHHC7MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110066631-B Packaging wax and preparation method thereof 广州市德馨蜡制品有限公司 2021-03-23 CN claimed
CN-105504836-A Low-needle-penetration paraffin supporting material used for 3D printing and preparation method thereof FOSHAN HANYU TECH CO LTD 2016-04-20 CN claimed
CN-110066631-B Packaging wax and preparation method thereof 广州市德馨蜡制品有限公司 2021-03-23 CN disclosed
EP-3152035-B1 METHODS OF PRINTING FULL-COLOR 3D ARTICLES 3D SYSTEMS INC (US) 2020-09-02 EP disclosed
US-20200071529-A1 WATER DISPERSIBLE SUPPORT MATERIALS FOR 3D PRINTING 3D SYSTEMS INCORPORATED (US) 2020-03-05 US disclosed
CN-110066631-A Pack wax and preparation method thereof 广州市德馨蜡制品有限公司 2019-07-30 CN disclosed
EP-2890748-B1 COLOR STABLE INKS AND APPLICATIONS THEREOF 3D SYSTEMS INC (US) 2019-07-10 EP disclosed
EP-3148782-B1 WATER DISPERSIBLE SUPPORT MATERIALS FOR 3D PRINTING 3D SYSTEMS INCORPORATED (US) 2019-05-08 EP disclosed
US-10232529-B2 Support material and applications thereof 3D SYSTEMS, INC. (US) 2019-03-19 US disclosed
EP-3044270-B1 BUILD MATERIAL AND APPLICATIONS THEREOF 3D SYSTEMS INC (US) 2018-08-29 EP disclosed
EP-2683774-B1 BUILD MATERIAL AND APPLICATIONS THEREOF 3D SYSTEMS INC (US) 2018-08-29 EP disclosed
US-7378460-B2 Ultra-violet light curable hot melt composition 3D SYSTEMS, INC. (US) 2008-05-27 US disclosed
US-7176253-B2 Phase change support material composition 3D SYSTEMS, INC. (US) 2007-02-13 US disclosed
US-20050080163-A1 Ultra-violet light curable hot melt composition 3D SYSTEMS, INC. 2005-04-14 US disclosed
US-6841589-B2 Ultra-violet light curable hot melt composition 3D SYSTEMS, INC. (US) 2005-01-11 US disclosed
US-20040242728-A1 Phase change support material composition 3D SYSTEMS, INC. 2004-12-02 US disclosed
EP-1458825-A1 ULTRA-VIOLET LIGHT CURABLE HOT MELT COMPOSITION 3D SYSTEMS, INC. (US) 2004-09-22 EP disclosed
US-20030100658-A1 Comprises fatty alcohol and abietic rosin ester alcohol tackifier; for three-dimensional ink jet printing, creating building materials 3D SYSTEMS, INC. 2003-05-29 US disclosed
US-20030092820-A1 Ultra-violet light curable hot melt composition 3D SYSTEMS, INC. 2003-05-15 US disclosed
WO-2003029366-A1 ULTRA-VIOLET LIGHT CURABLE HOT MELT COMPOSITION 3D SYSTEMS, INC. (US) 2003-04-10 WO disclosed