SCHEMBL501996

SCHEMBL501996

C=Cc1ccc(O)c2ccccc12

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 6/20 0.59
EP300 Q09472 2/20 0.46
KAT2B Q92831 2/20 0.46
KAT8 Q9H7Z6 2/20 0.46
HDAC3 O15379 1/20 0.46
NCOR2 Q9Y618 1/20 0.46
CTSL P07711 4/20 0.46
CAPN1 P07384 3/20 0.46
CTSB P07858 3/20 0.46
GCGR P47871 3/20 0.41
LDHA P00338 1/20 0.41
CYP1A2 P05177 1/20 0.39
APP P05067 1/20 0.39
MAPT P10636 1/20 0.39
THRB P10828 1/20 0.39
HPGD P15428 1/20 0.39
ALOX15 P16050 1/20 0.39
TSHR P16473 1/20 0.39
CASP1 P29466 1/20 0.39
SNCA P37840 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Formamide SCHEMBL9732415 0.90 IDO1 (0.48) IDO1EP300KAT2BKAT8HDAC3
SCHEMBL92353 0.86 IDO1 (0.46) IDO1EP300KAT2BKAT8HDAC3
SCHEMBL2100602 0.85 ALDH1A1 (0.48) IDO1CYP1A2MAPTTHRBHPGD
SCHEMBL29434197 0.85 ALDH1A1 (0.48) IDO1CYP1A2MAPTTHRBHPGD
SCHEMBL4017834 0.82 CYP1A2 (0.57) IDO1CYP1A2
SCHEMBL7708552 0.81 IDO1 (0.65) IDO1EP300KAT2BKAT8HDAC3
SCHEMBL3459911 0.79 IDO1 (0.50) IDO1EP300KAT2BKAT8HDAC3
SCHEMBL3459912 0.79 IDO1 (0.50) IDO1EP300KAT2BKAT8HDAC3
SCHEMBL20930329 0.79 ESR2 (0.38) IDO1APPMAPTTHRBHPGD
SCHEMBL21169965 0.78 HPGD (0.58) IDO1CYP1A2APPMAPTTHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 229 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119955197-A Water permeable floor for upgrading renewable resources of wind power generation blades 济南市阿波罗木塑复合材料有限公司 2025-05-09 CN claimed
US-12449731-B2 Photosensitive resin composition, method for producing resist pattern film, and method for producing plated formed product ISR CORPORATION (JP) 2025-10-21 US disclosed
CN-119955197-A Water permeable floor for upgrading renewable resources of wind power generation blades 济南市阿波罗木塑复合材料有限公司 2025-05-09 CN disclosed
US-20250147418-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE JSR CORPORATION (JP) 2025-05-08 US disclosed
WO-2025041686-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE JSR株式会社 2025-02-27 WO disclosed
WO-2025041685-A1 PHOTOSENSITIVE RESIN COMPOSITION FOR PRODUCING PLATED MOLDED ARTICLE, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE JSR株式会社 2025-02-27 WO disclosed
US-12174538-B2 Photosensitive resin composition, method for producing resist pattern film, method for producing plated formed product, and method for producing tin-silver plated-formed product JSR CORPORATION (JP) 2024-12-24 US disclosed
CN-112534353-B Photosensitive resin composition, method for forming resist pattern, method for producing plated molded article, and semiconductor device JSR株式会社 2024-12-24 CN disclosed
US-12158700-B2 Photosensitive resin composition, method for forming resist pattern, method for manufacturing plated molded article, and semiconductor apparatus JSR CORPORATION (JP) 2024-12-03 US disclosed
WO-2024190595-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN FILM, AND METHOD FOR PRODUCING PLATED SHAPED ARTICLE JSR株式会社 2024-09-19 WO disclosed
EP-1845416-A2 Coating compositions for photolithography Rohm and Haas Electronic Materials, L.L.C. (US) 2007-10-17 EP disclosed
US-20070238052-A1 Coating compositions for photolithography ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2007-10-11 US disclosed
US-20070122740-A1 Resist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-31 US disclosed
US-20070122740-A1 Resist undercoat-forming material and patterning process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2007-05-31 US disclosed
EP-0849634-B1 Radiation sensitive resin composition JSR CORP (JP) 2004-03-31 EP disclosed
US-6322949-B2 SULFONIUM COMPOUND AS PHOTOACID GENERATOR JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 2001-11-27 US disclosed
US-20010014427-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 2001-08-16 US disclosed
US-6187504-B1 PHOTOSENSITIVE BLEND CONTAINING A NAPHTHALENE SULFONIUM SULFONATE DERIVATIVE PHOTOACID GENERATOR, RESIN HAVING ALKALI INSOLUBLE GROUPS CLEAVABLE BY ACID, AN ALKALI SOLUBLE RESIN AND A SOLUBILITY CONTROL AGENT; POSITIVES, RESOLUTION JSR CORPORATION (JP) 2001-02-13 US disclosed
EP-0849634-A1 Radiation sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1998-06-24 EP disclosed
US-4517354-A PROTECTIVE COATINGS PLASTICS ENGINEERING COMPANY (US) 1985-05-14 US disclosed